Metal nanopaste sintering bonding compatible vacuum soldering device
A new model of Shinko Precision's vacuum soldering device has arrived, enhancing the quality of metal sintering joints with excellent thermal uniformity, temperature rise characteristics, and atmosphere control. This is a next-generation high-reliability sintering bonding device.
The vacuum soldering equipment from Shinko Seiki, which supports the production of power device modules, has been upgraded. It improves the heating and cooling characteristics and expands the processing dimensions. It accommodates the sintering bonding of metal paste through the conventional atmosphere control performance and the increase in processing temperature. The realization of low oxygen concentration and the reducing power of a 100% hydrogen atmosphere significantly enhance the wettability by preventing the oxidation of wet paste. The addition of an optional heating and pressurizing mechanism also enables void-free bonding. Shinko Seiki's new vacuum soldering equipment is compatible with next-generation bonding materials.
basic information
Significantly improved performance and processing capacity of the standard batch-type vacuum soldering equipment with a proven track record. Processing dimensions expanded by over 35%. Operating processing temperature increased by over 100°C. A new type of vacuum soldering equipment designed for mass production. Maintains a low-oxygen, high-reduction atmosphere during low-temperature sintering with vacuum replacement and hydrogen reduction atmosphere treatment, achieving high reliability in sintering joints of various metal nanopastes with atmosphere control technology not found in other soldering equipment.
Price information
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Delivery Time
Applications/Examples of results
Power device module creation Drying and firing of various materials Frit glass fusion and bonding Degassing of precision parts
