Achieving surface treatment similar to vacuum RIE under atmospheric pressure! Atmospheric pressure plasma system.
【Exhibition Participation!】Ideal for surface modification of BGA substrates and lead frames! Achieves processing effects close to vacuum RIE plasma through the adoption of a unique system!
Our atmospheric pressure plasma system, utilizing a unique design, enables Ar plasma treatment that was difficult to achieve with conventional atmospheric pressure methods, allowing for stable discharge. Additionally, ozone generation is significantly suppressed. Furthermore, by adopting a direct plasma method, we have achieved treatment effects comparable to vacuum RIE plasma. We can propose systems tailored to your desired processing format, such as magazine-to-magazine for lead frames, roll-to-roll, and sheet processing models. Please feel free to contact us. 【Main Effects】 - Surface activation - Organic material removal - Nano-etching 【Examples of Applications】 - Surface modification of semiconductor lead frames before wire bonding - Cleaning of BGA substrates - Cleaning of film surfaces - Surface modification of assembly-related components *We also offer sample demonstrations at our factory and can provide demo equipment for loan. Please feel free to contact us.
basic information
- Surface treatment close to vacuum RIE is achieved under atmospheric pressure conditions. - We can propose systems tailored to customer requests, such as automated machines. - Live demonstrations will be held at InterNepcon from January 21 (Wednesday) to January 23 (Friday), 2026, at Tokyo Big Sight. - Booth location: East Hall 4 E3-39 *For more details, please download the PDF or feel free to contact us.
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Model number/Brand name
SSC-AP Series
Applications/Examples of results
For more details, please download the PDF or feel free to contact us.
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Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.