Shinwa Co., Ltd. Mechatronics System Center Official site

Screw dispenser [LED post-process / board mounting]

Achieving ultra-precise dispensing through screw rotation! Extensive track record and versatility in LED/line coating/3D coating!

【Dispensing Industry Achieves Capability No.1】 Shinwa Screw Dispenser - LED Post-Processing / PCB Assembly Process ▶ Adjustment of dispensing amount based on screw rotation (Compatible with high-viscosity materials) ▶ Reduction in the number of equipment investments through high-speed dispensing (Compared to air dispensers: 2 to 5 times processing capacity) ▶ Increased stability of dispensing amount through room temperature discharge ▶ Significant reduction in yield loss, increased production efficiency! 【Applications】 ■ Secondary Underfill ■ LED Phosphors (General) (SMD/Side View/Dam & Fill, etc.) ■ Cream Solder (φ250~φ300μm) * The dispensing diameter may vary depending on the solder particles used. ■ Ag Paste ■ UV Curing Resin, among others.

basic information

【Features】 ◆ Adjustment of application amount by screw rotation (excellent application stability)! ◆ Achieves room temperature dispensing of high-viscosity materials!  → Capable of discharging high-viscosity materials by adopting a screw method.   (MAX: 500,000 mPa.s can be dispensed at room temperature) ◆ Realizes high-speed dispensing (compared to air: 1.5 to 2 times processing capacity) ◆ Adopts a one-touch replacement method, significantly reducing replacement time! ◆ Compatibility with line dispensing (acceleration/deceleration and corner dispensing adjustment functions) ◆ Achieves low running costs ◆ Simple software program We offer free sample testing for those considering a purchase. For details, please request materials or refer to the catalog.

Price information

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Delivery Time

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Applications/Examples of results

【Wide-ranging achievements in various industries/materials】 Shinwa Screw Dispenser ■Semiconductor back-end processes Dam & Fill / Cream solder / Ag paste / UV curing resin / Others ■LED back-end processes General dispensing of phosphors (SMD/PLCC/Dam & Fill, etc.) COB packages (5mg to 360mg) ■Board mounting Cream solder / Ag paste / Moisture-proof materials / UV curing resin Others ■HDD back-end processes Ag paste / Thermosetting resin / 3D dispensing Others ■MEMS Ag nano paste / UV nano paste Others

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