Visualizing minute changes of 3nm. By using an off-axis optical system and edge reflection light detection, we capture the distortion and scratches on the wafer surface in a wide area at once.

This is a unit that visualizes fine irregularities, scratches, and distortions on the wafer surfaces of materials like Si, SiC, and GaN, which are difficult to detect with the naked eye or under a microscope. It employs Sumix's unique "off-axis optical system" to sensitively detect changes in light reflection (edge reflected light) due to the angle of the surface. 【Defects that can be visualized】 ■ Nano-level surface irregularities and crystal defects ■ Slurry residues and fine scratches ■ Chipping and cracking after dicing It allows for a quick grasp of wide-area "inconsistencies" that are often overlooked in sampling inspections with a microscope, presented as macro images. This helps to eliminate bottlenecks in the inspection process and dramatically improves the accuracy of quality control. *For more details, please refer to the catalog or feel free to contact us. *We are currently accepting requests for evaluations of the actual device. The first sample evaluation will be provided free of charge.

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