Copper (Cu) target

Copper (Cu) target Purity: 3 N7~6N Crystal 40-80 um C18200 C18150 Handling

last updated Oct 27, 2025

Titanium Ti Target Purity≧5N5

Titanium Ti Target, Each type purity is possible

last updated Oct 27, 2025

Nickel (Ni) target Purity>4N5

Nickel (Ni) target Purity2N~4N5

last updated Oct 27, 2025

Hafnium (Hf) target

Hafnium (Hf) target Purity>4N5

last updated Oct 27, 2025

Chromium (Cr) target

Chromium (Cr) target Purity>3N8

last updated Oct 27, 2025

Tantalum (Ta) Target

Tantalum (Ta) Target Purity>5N

last updated Oct 27, 2025

Tin (Sn) target

Tin (Sn) target　Purity≧4N

last updated Oct 27, 2025

Niobium (Nb) target

Niobium (Nb) target　Purity≧3N5

last updated Oct 27, 2025

Tungsten (W) target

Tungsten (W) target Purity>5N

last updated Oct 27, 2025

Sputtering

Preventing oxidation using a vacuum device is important, and factors such as the dimensional tolerances of the target material are crucial for efficiency!

last updated Oct 31, 2025