A feature article was published in Electronics Packaging Technology, Volume 39, Issue 7 (released on June 20, 2023).

TAKAYA Corporation

●Feature "Design, Analysis, Simulation" ■Latest Trends in BGA Implementation Board Inspection Hybrid Inspection of Flying Probe Testers and JTAG Testing Andor System Support Co., Ltd. / Masazumi Taniguchi Takaya Co., Ltd. / Kohei Yanagida As electronic devices continue to evolve rapidly, and as new technology development emerges as an important theme for future advancements, reliable solutions that meet various demands are essential. In any case, design, analysis, and manufacturing solutions that consider each element are becoming increasingly complex and challenging, requiring professionals on-site to tackle the obstacles they face. This feature will introduce how current design, analysis, and simulation technologies are responding to various demands. Since its launch in 1985, this magazine has been the only domestic publication specializing in implementation technology, providing the latest information on electronic circuit design, manufacturing technology, materials, and manufacturing equipment trends. We focus on cutting-edge technologies and event information both domestically and internationally, delivering valuable information to various key players in the electronics industry.