Publication of the special feature article in Volume 39, Issue 7 of the specialized magazine "Electronics Packaging Technology."

TAKAYA Corporation

We have received permission to publish the feature article from the only domestic magazine specializing in implementation technology, "Electronics Implementation Technology," Volume 39, Issue 7. Please take a look. Overview BGA components are used in all types of electronic devices, from consumer products to industrial equipment, and more recently, automotive devices. However, a reliable method for inspecting printed circuit boards with BGA components has not been established. Every inspection method has its advantages and disadvantages, and it is not possible to conduct a complete test using only one inspection method. As a result, inspecting BGA-mounted boards has become a challenge for many companies. This time, as one solution to this issue, we will introduce the latest technological trends in hybrid testing that combines flying probe testers and JTAG boundary scan. 1. Introduction 2. Inspection and Challenges of BGA-Mounted Boards 3. Possibilities of Electrical Testing 4. In-Circuit Testing 5. JTAG Boundary Scan Testing 6. Hybrid Testing 7. Conclusion Andor System Support Co., Ltd. / Masazumi Taniguchi Takiya Co., Ltd. / Kohei Yanagida

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Collaboration with boundary scan testing using a flying probe tester.
We will create new value through the mutual complementarity of ICT and BST.

Please contact the sales representative.
Flying Probe Tester: APT-1340J *Evaluation tests currently accepted
It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry.

To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (PCB) and power is supplied. The process of contacting a specialized probe to the electronic circuit board, which has electronic components mounted on it, and applying a minute electrical signal for testing is called In-Circuit Testing (ICT), and the device used for this testing is referred to as an In-Circuit Tester. This method allows for the inspection of "connection reliability between electronic components and the board," "the values of individual mounted electronic components (such as resistors and capacitors)," and "diode polarity," without imposing unnecessary loads on the board itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection contents: ● Solder shorts and opens ● Pattern disconnections ● Missing components ● Incorrect component values ● Reverse insertion of polarized components ● Lifted leads of ICs and connectors ● Operation confirmation of digital transistors, optocouplers, and Zener diodes ● Other simple function tests
Flying Probe Tester: APT-1400F-SL * Testing in progress
It is a board inspection device capable of ultra-fast in-circuit testing at a top-class industry level. (Supported board size for inspection: up to 985×610)

To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (PCB) and power is supplied. The process of contacting a dedicated probe to the electronic circuit board, which has electronic components mounted on it, and applying minute electrical signals for testing is called In-Circuit Testing (ICT), and the device used for this testing is referred to as an In-Circuit Tester. This testing checks the "connection reliability between electronic components and the board," the "values of individual mounted electronic components (such as resistors and capacitors)," and the "polarity of diodes," all without imposing unnecessary loads on the board itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection contents: ● Solder shorts and opens ● Pattern disconnections ● Missing components ● Incorrect component values ● Reverse insertion of polarized components ● Lifted leads of ICs and connectors ● Operation verification of digital transistors, optocouplers, and Zener diodes ● Other simple function tests
Dual Side Flying Probe Tester: APT-1600FD
This is a flagship model that arranges probe heads on both the top and bottom, enabling simultaneous in-circuit testing of the front and back of the substrate.

To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (PCB) and power is supplied. The process of contacting a dedicated probe to the electronic circuit board, which has electronic components mounted, and applying minute electrical signals for testing is called In-Circuit Testing (ICT), and the device used for this testing is referred to as an In-Circuit Tester. This method allows for the inspection of "connection reliability between electronic components and the board," "the values of individual mounted electronic components (such as resistors and capacitors)," and "diode polarity," without imposing unnecessary loads on the board itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection items include: - Solder shorts and opens - Pattern disconnections - Missing components - Incorrect component values - Reverse insertion of polarized components - Lifted leads of ICs and connectors - Operation confirmation of digital transistors, optocouplers, and Zener diodes - Other simple function tests.
Dual Side Flying Probe Tester APT-1600FD-SL
The probe head is arranged above and below, allowing for simultaneous in-circuit testing of both sides of the substrate. (Supported substrate size for inspection: up to 985×610)

To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (substrate) and power is supplied. The process of contacting a specialized probe to the electronic circuit board, which has electronic components mounted on it, and applying minute electrical signals for testing is called In-Circuit Testing (ICT), and the device used for this testing is referred to as an In-Circuit Tester. This testing checks the "connection reliability between electronic components and the substrate," "the values of individual mounted electronic components (such as resistors and capacitors)," and "the polarity of diodes," without applying unnecessary load to the substrate itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection contents: - Solder shorts and opens - Pattern disconnections - Missing components - Incorrect component values - Reverse insertion of polarized components - Lifted leads of ICs and connectors - Operation confirmation of digital transistors, optocouplers, and Zener diodes - Other simple function tests