Notice of the 38th Spring Conference of the Electronics Packaging Society co-hosted by Tokyo University of Science.

TAKAYA Corporation

Takaya Corporation has become a sponsor of the "38th Spring Conference of the Electronics Packaging Society," which will be held at the Noda Campus of Tokyo University of Science from March 13 (Wednesday) to March 15 (Friday), 2024. On the day of the event, our employees will give presentations and showcase a company introduction booth on-site. We look forward to your visit. (Online viewing is also available.) [Presentation Content] Latest Trends in BGA Assembly Board Inspection Hybrid Inspection of JTAG Boundary Scan Testing and Flying Probe Testers Yuki Yanagida, Ryoki Horimoto, Yuya Sakamoto - Takaya Corporation Masayuki Taniguchi - Andor System Support Co., Ltd. To ensure reliable assembly guarantees for assembly boards, electrical testing is essential. However, relying on a single inspection method does not provide sufficient test coverage. To address this challenge, we will introduce a hybrid inspection system that integrates flying probe testers and JTAG boundary scan testing. By complementing each inspection method, we can maximize the test coverage for high-density assembly boards, enabling more accurate fault diagnosis.

Date and time Wednesday, Mar 13, 2024 ～ Friday, Mar 15, 2024
Capital Tokyo University of Science, Noda Campus 〒278-8510 2641 Yamazaki, Noda City, Chiba Prefecture Held in a hybrid format (online and in-person)
Entry fee Charge Pre-registration from the organizer's website is required to participate in the conference or to watch online.

Related product information

Flying Probe Tester: APT-1340J *Evaluation tests currently accepted
It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry.

To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (PCB) and power is supplied. The process of contacting a specialized probe to the electronic circuit board, which has electronic components mounted on it, and applying a minute electrical signal for testing is called In-Circuit Testing (ICT), and the device used for this testing is referred to as an In-Circuit Tester. This method allows for the inspection of "connection reliability between electronic components and the board," "the values of individual mounted electronic components (such as resistors and capacitors)," and "diode polarity," without imposing unnecessary loads on the board itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection contents: ● Solder shorts and opens ● Pattern disconnections ● Missing components ● Incorrect component values ● Reverse insertion of polarized components ● Lifted leads of ICs and connectors ● Operation confirmation of digital transistors, optocouplers, and Zener diodes ● Other simple function tests
Flying Probe Tester: APT-1400F-SL * Testing in progress
It is a board inspection device capable of ultra-fast in-circuit testing at a top-class industry level. (Supported board size for inspection: up to 985×610)

To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (PCB) and power is supplied. The process of contacting a dedicated probe to the electronic circuit board, which has electronic components mounted on it, and applying minute electrical signals for testing is called In-Circuit Testing (ICT), and the device used for this testing is referred to as an In-Circuit Tester. This testing checks the "connection reliability between electronic components and the board," the "values of individual mounted electronic components (such as resistors and capacitors)," and the "polarity of diodes," all without imposing unnecessary loads on the board itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection contents: ● Solder shorts and opens ● Pattern disconnections ● Missing components ● Incorrect component values ● Reverse insertion of polarized components ● Lifted leads of ICs and connectors ● Operation verification of digital transistors, optocouplers, and Zener diodes ● Other simple function tests
Dual Side Flying Probe Tester: APT-1600FD
This is a flagship model that arranges probe heads on both the top and bottom, enabling simultaneous in-circuit testing of the front and back of the substrate.

To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (PCB) and power is supplied. The process of contacting a dedicated probe to the electronic circuit board, which has electronic components mounted, and applying minute electrical signals for testing is called In-Circuit Testing (ICT), and the device used for this testing is referred to as an In-Circuit Tester. This method allows for the inspection of "connection reliability between electronic components and the board," "the values of individual mounted electronic components (such as resistors and capacitors)," and "diode polarity," without imposing unnecessary loads on the board itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection items include: - Solder shorts and opens - Pattern disconnections - Missing components - Incorrect component values - Reverse insertion of polarized components - Lifted leads of ICs and connectors - Operation confirmation of digital transistors, optocouplers, and Zener diodes - Other simple function tests.
Dual Side Flying Probe Tester APT-1600FD-SL
The probe head is arranged above and below, allowing for simultaneous in-circuit testing of both sides of the substrate. (Supported substrate size for inspection: up to 985×610)

To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (substrate) and power is supplied. The process of contacting a specialized probe to the electronic circuit board, which has electronic components mounted on it, and applying minute electrical signals for testing is called In-Circuit Testing (ICT), and the device used for this testing is referred to as an In-Circuit Tester. This testing checks the "connection reliability between electronic components and the substrate," "the values of individual mounted electronic components (such as resistors and capacitors)," and "the polarity of diodes," without applying unnecessary load to the substrate itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection contents: - Solder shorts and opens - Pattern disconnections - Missing components - Incorrect component values - Reverse insertion of polarized components - Lifted leads of ICs and connectors - Operation confirmation of digital transistors, optocouplers, and Zener diodes - Other simple function tests
Collaboration with boundary scan testing using a flying probe tester.
We will create new value through the mutual complementarity of ICT and BST.

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