TAKAYA Corporation Official site

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The provisional program for the 38th Spring Conference of the Electronics Packaging Society has been released.

TAKAYA Corporation

TAKAYA Corporation

On March 14 (Thursday) from 11:30 to 11:45, Mr. Yanagida, the Technical Director of Takaya Corporation, will give a presentation titled "Latest Trends in BGA Mounted Circuit Board Inspection: Hybrid Testing with JTAG Boundary Scan and Flying Probe Testers." Additionally, we plan to set up a sponsor booth within the venue for a simple exhibition. We look forward to your attendance. Date: March 13 (Wednesday) to March 15 (Friday), 2024 Location: Noda Campus, Tokyo University of Science (Noda City, Chiba Prefecture)

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HOME | 38th Electronics Packaging Society Spring Conference Program | 38th Electronics Packaging Society Spring Conference Program (PDF) Flyer (PDF)

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