Netherlands XYZTEC Bond Tester Sigma (Joint Strength Testing Machine)
The latest model Sigma meets a wide range of bonding strength measurement needs with just one unit, leading the global market.
The latest model from Dutch company XYZTEC. Equipped with a rotary head capable of accommodating six sensors, it boasts excellent operability, measurement accuracy, and multifunctionality, overwhelming competitors and achieving high cost performance. The rotary measurement head, high-speed operating stage, and rotary share sensor contribute to reduced work time. It also comes standard with a simplified pattern recognition automatic measurement function. By adding an optional image processing function, it can support more advanced automatic measurement and automatic recognition of failure modes. It has been widely adopted by major semiconductor, power device, and various electronic device manufacturers in Japan and around the world.
basic information
A bond tester that meets various strength measurement needs for semiconductors and electronic components. Equipped with six types of load cells (sensors) on a rotating head, it can handle everything from fine loads like gold wire pull tests to high load shear measurements of up to 200 kgf with just one unit. It responds to diverse needs in quality control of gold and aluminum wires in production environments, as well as in research and development. The rotating measurement head has received high praise for reducing the burden on operators and shortening work time, particularly in quality control in production settings. A basic model, Sigma Lite, is also available, allowing for reduced implementation costs tailored to customer needs.
Price information
It varies depending on the number of sensors, the type of work holder, whether it supports automatic measurement or not, and the availability of calibration-related accessories. For more details, please contact us.
Delivery Time
Model number/Brand name
Sigma (Sigma / Condor Sigma)
Applications/Examples of results
Quality control, process development, and research and development for production lines of various semiconductor devices, power modules, battery modules, etc. for the following applications: ○ Gold wire, aluminum wire, ribbon wire related Wire pull, ball shear, wedge shear Tweezer pull, peel ○ Die, surface mount components Shear, stud pull ○ Tweezer pull and shear strength testing of bumps on wafers We also accommodate measurements related to various semiconductor and electronic components. For more details, please contact us.
Line up（4）
| Model number | overview |
|---|---|
| Sigma MAG | A fully automatic measurement model that adds magazine supply and lead frame transport functions to the standard specification model. |
| Sigma Lite | A budget model with general specifications for stage movement speed, range of motion, measurement accuracy, etc. |
| High Load Compatible Model Sigma HF | A model developed for applications requiring measurements of 200kgf or more, featuring ultrasonic metal-joined terminals, busbars, and large area die shear of power modules. |
| Sigma W12 | A model optimized for wafer bump shear tests and tweezer pull tests, compatible with wafers up to 12 inches in size. |
