12-inch wafer compatible bump tester SigmaW12
Share of bumps on a maximum 12-inch wafer, the best bond tester for tweezer pull tests.
A multifunctional bond tester ideal for bump shear tests and tweezer pull tests on wafers up to 12 inches. The rotating measurement head eliminates the need for operators to change sensors (load cells). With a stage movement speed of up to 50 mm/sec, a wide range of bumps can be measured in a short time. The rotating shear sensor eliminates the need for wafer rotation. Automation is achieved through an automatic measurement program compatible with pattern recognition. An optional blower and vacuum cleaner can remove residue from the tool tip. A full-auto specification proposal including a wafer transport system is also available.
basic information
The latest model Sigma from Dutch company XYZTEC is a dedicated machine for 8-inch and 12-inch wafers. With a movable range of 500mm on the X-axis and 370mm on the Y-axis, it can measure the entire area of a 12-inch wafer. It supports wide-range measurements with a stage movement speed of up to 50mm/sec, ensuring stress-free operation. High-magnification offset cameras allow for observation and image recording of fracture surfaces. The automatic measurement function with pattern recognition significantly reduces labor in measurement tasks and eliminates variability caused by operators. It is equipped with a high-precision sensor (load cell) with an error of ±0.075%. The rotary head can accommodate up to six sensors, eliminating the need for operators to switch sensors during share and pull transitions. The fully automatic model compatible with EFEM specifications has been adopted by major semiconductor manufacturers overseas.
Price information
Prices vary depending on specifications. Please contact us for more details.
Delivery Time
Model number/Brand name
Sigma W12
Applications/Examples of results
Share test of solder bumps on the wafer, tweezer pull test, share test of gold bumps.
