Sigma, the ideal bond tester for strength testing of bonding wires.
Equipped with various load cells on a rotary head, there is no need for operators to replace the load cells! Ideal for quality control and condition setting of various bonding wires.
The Dutch company XYZTEC's bond tester Sigma can freely combine and mount up to six types of load cells (sensors) on its rotating head. With this single unit, it supports pull and shear tests for gold wire, pull, shear, and tweezer pull tests for aluminum wire, and pull shear tests for Al ribbon wire. There is no need for operators to change load cells (cartridges) or set range switches. This reduces work time and prevents accidents from dropping or damaging load cells. Additionally, its smooth stage operation, wide range of motion, automatic pull hook rotation function, and shear sensor's Θ rotation mechanism significantly enhance work efficiency. The utility requirement is only 100VAC (no compressed air needed). It has a proven track record of deliveries to many major semiconductor manufacturers both globally and domestically.
basic information
XYZTEC in the Netherlands is a specialized manufacturer of bond testers. As a pioneer of the unique rotating head, it leads the global semiconductor market for joint strength testing with its latest model, Sigma. Demo units are permanently available at our headquarters in Shinagawa, Tokyo. Please feel free to contact us for requests regarding demo unit evaluations.
Price information
It varies depending on the specifications. Please contact us.
Price range
P6
Delivery Time
OTHER
9 to 12 weeks (in the case of standard specifications)
Model number/Brand name
XYZTEC Bond Tester Sigma
Applications/Examples of results
- Pull, share, and tweezer pull/peel tests of gold wire, copper wire, aluminum wire, and Al ribbon wire for various semiconductors and electronic devices. - Die share, gold bump share.
