Bond tester SigmaMAG, compatible with lead frame transport and automatic measurement.
Includes supply and transport from the magazine of lead frame products, and supports automatic measurement of wire pull, shear, and solder ball shear using image recognition.
The Dutch company XYZTEC's bond tester SigmaMAG supports automatic measurement for samples such as lead frames, including supply from magazines, bonding wire pull and shear tests, and solder ball shear tests. With advanced pattern matching capabilities compatible with Halcon's image processing, it provides automatic measurement functions that minimize operator intervention. Previously, a work holder that fixed the entire lead frame was necessary for automatic measurement across the entire lead frame, which posed issues regarding cost and uniformity of pressure. However, this problem has been resolved with the incorporation of an automatic pitch feeding function. It also supports specifications without a magazine handler (manual handling of lead frames) and full cabinet specifications compliant with SEMI S2 safety standards. For more details, please contact us.
basic information
XYZTEC, a Dutch company, is a manufacturer specializing in bond testers that has developed and provided bond testers to meet user needs. The SigmaMAG model was released in response to the demand for automation in joint strength testing from many users. Automating joint strength testing not only reduces costs but also directly contributes to product quality by stabilizing measurement results.
Price range
Delivery Time
Model number/Brand name
Bond tester Sigma MAG by Dutch company XYZTEC
Applications/Examples of results
Pull tests and shear tests of various wires for semiconductor/electronic components (lead frame products), as well as shear tests of solder balls (solder bumps).
