Area Laser Soldering (Solder/Reflow) Equipment
FR-4 not only allows for solder bonding to heat-resistant substrates, but also to substrates with lower heat resistance temperatures such as PC and PET. It is an innovative area laser device.
Uniform laser heating with a consistent temperature profile is made possible by 80mm x 80mm uniform infrared laser irradiation. The irradiation area is selectable, with regions configurable from 3mm x 3mm to 80mm x 80mm. Furthermore, we can uniquely design an optical system for high-angle heating for 200mm wafers and uniform light for 0603 capacitors. This technology has the following features: **Features** - The size and shape of the constant temperature area can be selected as circular, square, or rectangular. - Variable laser output. - Solder bonding to low melting point substrates such as PC, PET, and PEN is possible. - Minimal thermal stress on the substrate, reducing warping. - Soldering at different temperatures within the same substrate is possible. - High productivity with soldering in just a few seconds. - Capability to create temperature profiles during soldering. - No cooling space required. **Applications** - Electronic component mounting. - LED mounting. - 2D probe pin mounting. - Electronic component mounting on flexible substrates. - Mounting only at specific locations on the substrate. - 3D mounting. - Micro LED mounting. *Product demos are currently being accepted. Please feel free to contact us.*
basic information
【Proprietary Technology: Area Laser】 ◆Realization of Wide-Area Laser Irradiation & Constant Temperature Zone The temperature profile of a typical laser beam has a peak shape that is high temperature at a pinpoint. Thanks to the beam shaper developed by Laserssel, the heat supply profile from the infrared laser has become uniform. As a result, there is high thermal uniformity, and issues such as localized burning or melting do not occur. The expansion of the laser beam uses a uniquely designed optical system, and its energy uniformity is said to be among the best in the industry. For more details, please refer to the PDF document.
Price range
Delivery Time
Model number/Brand name
Area Laser Soldering Systems
Applications/Examples of results
1. Area Laser Reflow System 2. Area Laser Soldering Device 3. Area Laser 2D Probe Pin Soldering Device 4. Soldering Device for Electronic Components on Thin Substrates (Polyimide, PET, PEN, etc.) 5. Soldering Device for Automotive Battery Components 6. Mini LED Rework Device 7. Mounting Board Rework Device
