Low-temperature film-forming low thermal expansion polyimide
Achieve low thermal expansion with low-temperature film formation!
"Low-temperature film-forming low thermal expansion polyimide" can be film-formed at lower temperatures than conventional polyimides, which reduces thermal stress and allows for use similar to that of epoxy and other materials. It achieves high production efficiency and labor-saving, making it suitable for applications such as interlayer insulating films (for semiconductor devices, multilayer printed wiring boards, and package substrates). [Features] - Thermal expansion coefficient graded from 2 to 20 ppm/K (can be matched to the thermal expansion coefficients of various substrates) - Varnish can be stored at room temperature *For more details, please download the PDF or feel free to contact us.
basic information
【Applications】 ■ Interlayer insulating film (for semiconductor devices, multilayer printed circuit boards, package substrates) ■ Protective film for semiconductor devices ■ Buffer coat film ■ Insulating film for silicon-glass interposers *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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Our company will contribute to the next-generation industrial sector by developing new high-performance polyimide resins that respond to changing market needs. By incorporating functions not found in conventional polyimide materials (such as heat dissipation, transparency, conductivity, and adhesion) into our own polyimide products, we aim to create high-value-added polyimide materials, further stimulating the development of next-generation industrial equipment and striving to be a company that meets these demands.