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Low-temperature film-forming low thermal expansion polyimide
Achieve low thermal expansion with low-temperature film formation!
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Low-temperature film-forming low thermal expansion polyimide 'WGv-2400/2500 series'
It can reduce thermal stress and allows for similar use as epoxy! Achieves high production efficiency and labor saving.
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Transparent polyimide
By innovating in molecular design and raw material structures, we have significantly improved transparency in the visible light range!
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Next-generation LIB binder
Demonstrates excellent cycle stability and high capacity retention rate, supporting the high performance required for next-generation batteries!
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Low dielectric constant polyimide
We will contribute to the high performance required in advanced technology fields, starting with 5G and 6G communications!
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