Low-temperature film-forming low thermal expansion polyimide 'WGv-2400/2500 series'
It can reduce thermal stress and allows for similar use as epoxy! Achieves high production efficiency and labor saving.
The "WGv-2400/2500 series" is a product that can form a film at low temperatures. It can be matched to the thermal expansion coefficients of various substrates, accommodating a wide range of materials. It also offers ease of handling, such as the ability to store the varnish at room temperature. Please feel free to contact us when you need assistance. 【Features】 ■ Achieves lower temperature film formation and lower thermal expansion coefficients ■ Reduces thermal stress, allowing for use similar to epoxy and other materials ■ Enables high production efficiency and labor-saving ■ Grades thermal expansion coefficients from 2 to 20 ppm/K ■ Allows for room temperature storage of varnish *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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【Applications】 ■ Interlayer insulating film (for semiconductor devices, multilayer printed circuit boards, package substrates) ■ Protective film for semiconductor devices ■ Buffer coat film ■ Insulating film for silicon-glass interposers *For more details, please download the PDF or feel free to contact us.
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Our company will contribute to the next-generation industrial sector by developing new high-performance polyimide resins that respond to changing market needs. By incorporating functions not found in conventional polyimide materials (such as heat dissipation, transparency, conductivity, and adhesion) into our own polyimide products, we aim to create high-value-added polyimide materials, further stimulating the development of next-generation industrial equipment and striving to be a company that meets these demands.