Low dielectric constant polyimide
We will contribute to the high performance required in advanced technology fields, starting with 5G and 6G communications!
The low dielectric polyimide developed by our company is a high-performance material designed for high-speed communication and high-frequency devices. Compared to general polyimides, it achieves low dielectric constant and low dielectric loss tangent, while also possessing high heat resistance and low moisture absorption. It significantly reduces the loss of high-frequency signals and improves communication performance. Even in high-temperature environments, it maintains excellent dimensional stability and reliability, suppressing degradation of properties due to humidity changes. 【Features】 ■ Low dielectric constant and low dielectric loss tangent ■ High heat resistance ■ Low moisture absorption ■ High adhesion *For more details, please download the PDF or feel free to contact us.
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Our company will contribute to the next-generation industrial sector by developing new high-performance polyimide resins that respond to changing market needs. By incorporating functions not found in conventional polyimide materials (such as heat dissipation, transparency, conductivity, and adhesion) into our own polyimide products, we aim to create high-value-added polyimide materials, further stimulating the development of next-generation industrial equipment and striving to be a company that meets these demands.