[December 13, 2023 - December 15, 2023] Yamashita Material Announcement of Participation in SEMICON Japan 2023 Special Exhibition "7th FLEX Japan 2023"

山下マテリアル

We would like to inform you that we will be exhibiting at the special exhibition "7th FLEX Japan 2023" at SEMICON Japan 2023 from December 13 (Wednesday) to December 15 (Friday). FLEX Japan is the only international exhibition in Japan specializing in FHE (Flexible Hybrid Electronics). It will showcase a variety of the latest thin, lightweight, and bendable flexible electronics, as well as hybrid technologies combining rigid silicon semiconductors. Flexible devices can only be fully appreciated through seeing and touching them, which fosters discussion. We would be grateful if you could stop by the Yamashita Material booth during your visit. [Main Exhibits] - Long-term high-temperature durable FPC - Low-loss FPC - Big Elec (high-current FPC) We understand this is a busy time, but we sincerely look forward to your visit.

Date and time Wednesday, Dec 13, 2023 ～ Friday, Dec 15, 2023
10:00 AM ～ 05:00 PM
Capital 【Venue】 Tokyo Big Sight East Hall 2 【Booth Number】 2927 【Access by Train】 1. Take the JR Saikyo Line or Rinkai Line to "Kokusai Tenjijo Station." It is about a 7-minute walk from Kokusai Tenjijo Station to Tokyo Big Sight. 2. Take the Yurikamome to "Tokyo Big Sight Station." It is about a 5-minute walk from Tokyo Big Sight Station to Tokyo Big Sight. 【Access by Bus】 TOKYO BRT, Toei Bus, and JR Bus Kanto connect Tokyo Big Sight with Toranomon, Shimbashi, Monzen-Nakacho Station, and Tokyo Station. For details, please check the websites of each bus company. TOKYO BRT: https://tokyo-brt.co.jp Toei Bus: https://tobus.jp/blsys/navim JR Bus Kanto: http://time.jrbuskanto.co.jp/bk04110.html 【Access by Car】 It takes about 10 minutes by car from the "Rinkai Fukutoshin" exit or the "Ariake" exit of the Shuto Expressway Bayshore Route. Due to heavy congestion in nearby parking lots during the exhibition, we recommend using public transportation.
Entry fee Free

Related product information

Flexible Circuit Board Manufacturing Service for Short Lead Times and Small Batches
"FPC Manufacturing Case Studies" now available! Single-sided FPC production starts from 1 day and double-sided FPC production from 2 days, with production available from 1 piece. We also support pattern design and component assembly.

【List of Materials and Processing Methods】【Base Material】 Base Material Type: Polyimide Base Thickness: 12μm, 25μm, 50μm Copper Foil Thickness: 12μm, 18μm, 35μm Base Material Type: Liquid Crystal Polymer (LCP) Base Thickness: 50μm Copper Foil Thickness: 12μm 【Standard Coverlay/Resist】 Insulating Film Type: Polyimide Insulating Film Thickness: 12.5μm, 25μm Adhesive Thickness: 15μm, 25μm, 35μm Insulating Film Type: Liquid Crystal Polymer (LCP) Insulating Film Thickness: 50μm Resist Ink Type: Solder Resist for FPC 【Reinforcement Plate Types】 Polyimide Reinforcement Plate: 75μm, 125μm, 180μm, 225μm Glass Epoxy Reinforcement Plate: 0.5mm, 1.0mm, 1.6mm 【Surface Treatment Plating】 Electroless Gold Flash Plating (ENIG) Electrolytic Gold Plating Nickel Palladium Gold Plating (ENEPIG) Electrolytic Tin Plating Heat-Resistant Preflux 【Outline Processing Methods】 Simple Type Processing, Mold Processing, Laser Processing
High Current Compatible Flexible Circuit Board BigElec
Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.

Maximum current value: 10A to 100A Maximum dimensions: 480mm × 200mm Supported layers: 2 layers to 8 layers Conductor thickness per layer: up to 100μm thick
Big Elec SMT Connect (High Current FPC Shunt Specification)
Flexible substrate that bends freely and supports high current! Easily connects in tight spaces! Big Elec SMT Connect.

Main line Big Elec with implemented receptacle Rated: 60A Receptacle: Hirose Electric BM25-4S/2-V(53) Layers: 4 layers Branch line Big Elec with implemented plug Rated: 10A, 20A Plug: Hirose Electric BM25-4P/2-V(53) Layers: 1 layer or 2 layers
Low-rebound, high-speed transmission flexible substrate
Approximately one-third the rebound force compared to conventional structures! Low-rebound FPC for communication devices that combines noise reduction and high-speed transmission.

【Layer Structure】 ■Insulator ■Conductor GND Layer ■Adhesive ■Insulator (Polyimide) ■Adhesive ■Conductor RF Line ■Insulator (Polyimide) ■Adhesive ■Conductor GND Layer ■Insulator *For more details, please refer to the PDF document or feel free to contact us.
Low-loss flexible substrate
Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!

For more details, please refer to the PDF document or feel free to contact us.
Reduce reflection points! "Multilayer flexible substrate for high-speed transmission"
It is suitable for high-frequency applications in the tens of GHz range, and because it allows for high-density RF lines compared to PCBs, it is effective for miniaturizing products.

【Specifications】 ■Number of Layers: 3 to 8 layers ■Connection Via: Through Via, Blind Via, Filled Via ■Base Material: Polyimide, Liquid Crystal Polymer ■FPC Thickness: Approximately 200 to 800 μm ■Surface Treatment: Gold Flash, Nickel Palladium Gold, Lead-Free Solder Plating *For more details, please refer to the PDF document or feel free to contact us.
Card edge compatible multi-layer separated flexible printed circuit board (FPC)
Can be used with bent shapes and supports high-speed transmission! Ideal for integration in tight spaces. Integration of connections between circuit boards is also possible. *There is a video that explains it in 2 minutes!

Flexible printed circuit boards (FPC) allow for partial bending processing unique to them, enabling high-density wiring through the formation of 100μm pitch wiring and vias with a land diameter of φ300μm or less. In addition to mounting package components like BGA, it is also possible to mount bare chips on the FPC and connect them using wire bonding.
Ground slit MSL structure flexible printed circuit board
The thinning of flexible substrates is effective for assembly in narrow spaces! Required in areas where low spring back and high bending flexibility are needed.

For more details, please refer to the PDF document or feel free to contact us.