BigElec Fold - High Current Flexible Circuit Board - New Product
BigElec Fold - Customize flexible high-current wiring at a reasonable price.
BigElec Fold is a flexible and cost-effective high-current wiring solution that serves as an alternative to busbars and wire harnesses. ■ Features - Thin and flat printed circuit board structure - Customizable according to the desired shape and applied current of the customer - Two-layer construction allows for cost reduction and bending processing BigElec Fold emphasizes cost performance by limiting itself to a two-layer structure instead of a multi-layer one. This reduces material costs and makes bending processing easier, allowing for folding as well. BigElec Fold can connect to multiple terminals in its flat state, and by folding the wiring, it can also be accommodated in tight spaces. It can be freely designed and folded according to the application and wiring space. It realizes innovative ideas in the design field and provides excellent cost performance. BigElec Fold paves the way for the next stage of high-current wiring and meets customer expectations.
basic information
■ Specifications - Wiring width: 8mm to 210mm - Total length: 30mm to 500mm - Terminal diameter: M3, M4, M5, M6, M8 (custom sizes available) - Customizable product thickness and component mounting options
Price range
P3
Delivery Time
P4
Model number/Brand name
BigElec Fold
Applications/Examples of results
Coming Soon
Detailed information
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Current carrying capacity/temperature rise test conditions Equivalent to 8 layers, no bending items
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Test conditions for allowable current/temperature rise Equivalent to 8 layers / Folded state product
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Current carrying capacity/temperature rise test conditions Equivalent to 16 layers, no bending items
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Current capacity/temperature rise test conditions for 16-layer equivalent products and folded state products.
