株式会社アドウェルズ Official site

Flexible substrate ultrasonic bonding application

There are advantages of ultrasonic bonding such as low resistance, short time, and room temperature joining!

We would like to introduce our "Flexible Substrate Ultrasonic Joining Applications." The advantages of ultrasonic joining include low resistance due to direct bonding, the ability to join in less than one second, and no thermal expansion of the substrate. Additionally, the joining variations can be done with bumped leads and flying leads. 【Features】 ■ Low resistance joining ■ Short joining time ■ Room temperature joining *For more details, please download the PDF or feel free to contact us.

Related Link - https://www.adwelds.com/

basic information

For more details, please download the PDF or feel free to contact us.

Price range

Delivery Time

Applications/Examples of results

For more details, please download the PDF or feel free to contact us.

Flexible substrate ultrasonic bonding application

PRODUCT

News about this product(2)

Recommended products

Distributors

In addition to our unique technologies such as ultrasonic application technology, we contribute to our customers' technological innovations as a device manufacturer in the following business areas, including research and development and mass production processes, by flexibly responding to customer needs. Our devices are designed with the premise of freely controlling processes using cutting-edge device technology and process technology, serving as tools to realize ideas and assist in our customers' product innovations. ■ Core Technologies - Ultrasonic application technology (expanding applications in the fields of bonding, cutting, and welding) - Actuator technology (achieving simultaneous control of position and load with our unique air pressurization technology) - Device technology (providing functions that satisfy customer needs in the form of devices) ■ Business Areas Developing, manufacturing, and selling product manufacturing equipment in the following fields: - Secondary battery field - Electronics field - Automotive field - High-performance materials field - Carbon fiber reinforced resin field