Released a new COM Express module featuring the 6th generation Intel Core and the latest Intel Xeon processors.

ADLINKジャパン東京本社

A new COM (Computer On Module) has been announced that adopts the 6th generation Intel Core i7/i5/i3 processors and the latest Xeon processors. These new modules are designed based on principles of optimal flexibility for upgrades and application scalability, enabling rapid development and market introduction of embedded applications.

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COM Express【Express-SL/SLE】
6th generation Intel Xeon, Core, Celeron equipped basic size COM Express Type 6 module

Basic size COM Express Type 6 module equipped with 6th generation Intel Xeon, Core, and Celeron processors (code name: Skylake) supporting ECC/non-ECC. 【Features】 - Adopts 6th generation Intel Xeon, Core, and Celeron processors and Intel QM170, HM170, CM236 chipsets - Supports up to 32GB of dual-channel DDR4 (2133/1867 MHz) (ECC/non-ECC) - Supports up to 3 independent displays with 3x DDI channels and 1x LVDS (or 4-lane eDP) - Equipped with PCIe x1 x8 and PCIe x16 x1 (3rd generation) - Includes GbE, SATA 6 Gb/s x4, USB 3.0 x4, USB 2.0 x4 - Supports SEMA (Smart Embedded Management Agent) functionality - Supports Extreme Rugged operating temperature range of -40℃ to +85℃ (optional)
Compact COM Express【cExpress-SL】
Compact-size COM Express Type 6 module equipped with 6th generation Intel Core and Celeron processors.

Compact-size COM Express Type 6 module equipped with 6th generation Intel Core and Celeron processors (code name: Skylake) 【Features】 - Equipped with 6th generation Intel Core and Celeron processors - Supports up to 32GB of non-ECC dual-channel DDR4 (2133/1867 MHz) - Supports up to 3 independent displays via DDI channel x1, 1x LVDS (or 4-lane eDP) - Equipped with PCIe x1 x5 (configurable to 2nd generation, x2, x4) - Supports SEMA (Smart Embedded Management Agent) functionality - Operates in Extreme Rugged temperature range of -40°C to +85°C