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COM Express compact size Type 6 module equipped with the largest quad-core Intel Core and Celeron processors.

COM Express compact size Type 6 module equipped with the maximum quad-core Intel Core and Celeron processors 【Features】 - Intel Core and Pentium/Celeron processors - Up to 32GB dual-channel non-ECC DDR4 at 2133/2400MHz - Supports two DDI channels, one LVDS (4-lane eDP), one optional VGA, and up to three independent displays - Up to eight PCIe lanes, GbE - Up to three SATA 6 Gb/s, four USB 3.0, and four USB 2.0 - Smart Embedded Management Agent (SEMA) functionality support - Extremely robust operating temperature: -40°C to 85°C (optional)

Basic Size COM Express Type 6 Module

COM Express Type 6 Basic Size Module with Maximum Hexa-Core 8th Generation Intel Core 8000 Series and Intel Xeon Processors 【Features】 - PICMG COM.0 R3.0 Type 6 module, equipped with hexa-core Intel Core 8000 series and Xeon E-2000 series processors - Up to 48GB of dual-channel DDR4 (2133 / 2400MHz) - Supports three DDI channels, one LVDS (or 4-lane eDP), and up to three independent displays - One PCIe x16 Gen3, eight PCIe x1 Gen3 (support for NVMe SSD and Intel Optane memory technology) - GbE, four SATA 6 Gb/s, four USB 3.1, four USB 2.0 - Compatible with Smart Embedded Management Agent (SEMA) functionality

7th generation Intel Xeon, Core equipped basic size COM Express Type 6 module

7th Generation Intel Xeon, Core Equipped Basic Size COM Express Type 6 Module 【Features】 - Equipped with 7th Generation Intel Core/Xeon Processor (formerly known as Kaby Lake) - Intel QM175/HM175/CM238 Chipset - 32 GB Dual Channel DDR4 at 2133/2400 MHz - DDI Channel x3, LVDS x1 (or eDP), three independent displays - PCIe x1 (Gen3) x8 and PCIe x16 (Gen3) x1 - GbE, SATA 6 Gb/s x4, USB 3.0 x4, USB 2.0 x4 - Support for Smart Embedded Management Agent (SEMA) functionality - Extremely robust operating temperature: -40℃ to +85℃ (optional)

Basic size COM Express Type 7 module equipped with up to 16 cores of Intel Xeon D and Pentium.

Basic size COM Express Type 7 module equipped with up to 16-core Intel Xeon D and Pentium 【Features】 - Up to 16-core Intel Xeon D series SoC (formerly codenamed: Broadwell-DE) - Up to 32GB of dual-channel DDR4 ECC at 1867/2133/2400MHz (dependent on SoC SKU) - Support for two 10G Ethernet and NC-SI - Up to 8 PCIe x1 (Gen2), 1 PCIe x16 (Gen3) - GbE, two SATA 6 Gb/s, four USB 3.0/2.0 - Compatible with Smart Embedded Management Agent (SEMA) functionality - Extreme rugged operating temperature: -40℃ to 85℃ (build option)

Intel Atom E3900/Pentium/Celeron SoC Compact Size COM Express Type 6 Module

Intel Atom E3900/Pentium/Celeron SoC Compact Size COM Express Type 6 Module 【Features】 - Intel Atom E3900 series, Pentium, and Celeron SoC (VT-x/VT-d support) - Up to 8GB of dual-channel non-ECC DDR3L at 1867/1600MHz - Latest Intel Gen9 low-power graphics, supporting up to 4k resolution and H.265 codec - Supports two DDI channels, one LVDS (VGA/eDP via build option), and up to three independent displays - Up to five PCIe x1 Gen2 (configurable to x2, x4), eMMC 5.0 (build option) - Two SATA 6 Gb/s, two USB 3.0, and six USB 2.0, GbE - Extreme rugged operating temperature: -40℃ to +85℃ (build option for selected SKUs)

6th generation Intel Xeon, Core, Celeron equipped basic size COM Express Type 6 module

Basic size COM Express Type 6 module equipped with 6th generation Intel Xeon, Core, and Celeron processors (code name: Skylake) supporting ECC/non-ECC. 【Features】 - Adopts 6th generation Intel Xeon, Core, and Celeron processors and Intel QM170, HM170, CM236 chipsets - Supports up to 32GB of dual-channel DDR4 (2133/1867 MHz) (ECC/non-ECC) - Supports up to 3 independent displays with 3x DDI channels and 1x LVDS (or 4-lane eDP) - Equipped with PCIe x1 x8 and PCIe x16 x1 (3rd generation) - Includes GbE, SATA 6 Gb/s x4, USB 3.0 x4, USB 2.0 x4 - Supports SEMA (Smart Embedded Management Agent) functionality - Supports Extreme Rugged operating temperature range of -40℃ to +85℃ (optional)