3D Camera Rindo HF (Wide View) Series
Industrial 3D camera that achieves high resolution and high precision measurements.
The Rindo HF series is a 3D camera using structured light technology that is highly suitable for micron-level detection and measurement. By combining an industrial DLP projector optimized for structured lighting technology with an industrial camera, it achieves a high field of view model that maintains very high measurement stability while enabling measurements over a wide field of view. For 3D measurement, you can choose from three models tailored to various resolutions and measurement ranges.
basic information
10 million points of point cloud data Achieves micron-level measurement accuracy with high repeatability Significantly improves customer development efficiency with rich measurement software features Flexible support for mounting on robots and electric turntables Covers a wide field of view and accommodates more applications
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Applications/Examples of results
3D measurement, 3D scanning Visual inspection Production equipment applications Robot
Line up（3）
| Model number | overview |
|---|---|
| HF3550M | WD: 500-700mm / Field of view (@500mm): 320x267mm / Field of view (@700mm): 523x371mm / Resolution: 5MP / XY resolution: 250µm / Z-axis repeatability: 80µm / Scan rate: 1.3fps |
| HF35100M | WD: 500-700mm / Field of view (@500mm): 523x371mm / Field of view (@700mm): 759x527mm / Resolution: 5MP / XY resolution: 400µm / Z-axis repeatability: 100µm / Scan rate: 1.3fps |
| HF35130M | WD: 500-700mm / Field of view (@500mm): 759x527mm / Field of view (@700mm): 1106x840mm / Resolution: 5MP / XY resolution: 550µm / Z-axis repeat accuracy: 300µm / Scan rate: 1.3fps |
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We focus on the design, development, manufacturing, and sales of high-speed, high-resolution, and highly reliable machine vision cameras primarily using CoaXPress and CameraLink. In addition to developing standard products, we also offer development and customization tailored to customer requests. All camera design and development is carried out by our Japanese staff, ensuring design and production techniques that guarantee delicate and highly reliable standards in Japan, while integrating the dynamic action and speed of China to provide competitive products. At Japan Bopixel, we have successfully become the first camera manufacturer to utilize Ultra Low Power FPGA instead of the standard FPGA adopted by the majority of camera manufacturers. This Ultra Low Power FPGA reduces power consumption by over 50% compared to similar class FPGAs, significantly lowering power consumption and heat generation in cameras by addressing the heat source at its root. By actively adopting these next-generation key devices, we are taking a new approach to the heat generation issues that have traditionally been a challenge.