Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank everyone who visited us. We look forward to your continued support. We are honored to have the opportunity to exhibit at the IEEE International 3D Systems Integration Conference (3DIC). We hope to engage with many guests while participating in this platform for presenting cutting-edge technologies related to semiconductor processes.

Thanks to everyone, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank all those who visited us. We look forward to your continued support. ------------------------------------------------- At the Nepco Japan Autumn / Electronics Development and Implementation Exhibition, we will be showcasing our die bonding equipment at our booth. ■■■ Live Demonstration of FINE PLACER lambda2 ■■■ We will be exhibiting the compact tabletop die bonder/flip chip bonder lambda2. Fine Tech offers a wide range of products, from manual models to semi-automatic and fully automatic models. We will introduce high-precision implementation methods and the latest applications for various electronic devices, optical transmission and reception devices, MEMS, and micro components. We apologize for the inconvenience, but if you have time, please feel free to stop by.

Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude and extend my sincere thanks to everyone who attended.

Thanks to everyone, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank all those who visited us. We look forward to your continued support. At the Nepco Japan Autumn / Electronics Development and Implementation Exhibition, we will be showcasing our die bonding equipment at our booth. ★Demo Equipment Display★ We will exhibit the compact tabletop model, designed for prototype research purposes, the die bonder, and the flip chip bonder, lambda2. Faintech offers a wide range of products, from manual models to semi-automatic and fully automatic models. We will introduce high-precision implementation methods and the latest applications for various electronic devices, optical transmission and reception devices, MEMS, and micro components. We apologize for the inconvenience, but if you have time, please feel free to stop by.

Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank everyone who visited us. ------------------------------------------------------------------------------------ Exhibition Participation Announcement (NEPCON Japan 2022 @ Tokyo Big Sight) We would like to express our sincere gratitude for your continued support. Fine Tech Japan will be participating in NEPCON Japan 2022, which will be held from January 19. On that day, we will showcase a live demonstration of the high-precision die bonder lambda2. We will also be available to introduce other models and answer any questions regarding various die bonding techniques, so we sincerely look forward to your visit. NEPCON Japan 2022 Semiconductor and Sensor Packaging Technology Exhibition Dates: January 19 (Wed) - 21 (Fri), 2022 Venue: Tokyo Big Sight, East Hall 3, Booth No. 26-45

Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude and extend my sincere thanks to everyone who attended.

Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude and extend my sincere thanks to everyone who attended.

Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank everyone who attended.