【Features】 - Optimal material selection for heat dissipation sheets based on heat generation and environment - Precision processing such as square and irregular shapes, holes, and notches tailored to the mounting location - A flexible supply system capable of roll supply from prototyping to mass production - Proposals considering thermal conductivity, thickness, hardness, electrical insulation, and environmental resistance - Various processing options including adhesive processing, lamination, and half-cutting 【Our Strengths】 Gorin Packing specializes in the punching of soft materials, realizing our customers' "desired shapes" with reliable technology. We support manufacturing from various angles, including material selection and prototyping proposals during the design phase, a system capable of handling small to large production runs, and processing accuracy that considers ease of handling on-site. As a trusted partner for our customers, we continue to engage in careful manufacturing.

Heat dissipation sheet punching processing proposed by Olympic Packing Co., Ltd.

■CPU・GPU: Heat transfer between high-heat components and heat sinks ■GPU peripheral VRAM/HBM: Gap measures between multiple memory and heat sinks ■VRM・MOSFET and other power circuits: Heat dissipation and insulation measures for power circuit components ■SSD and storage peripherals: Heat measures for controllers and NAND, etc. ■Power supply unit and power semiconductors: Heat dissipation measures for high-heat and high-voltage components ■Back of the circuit board, casing, and backplate: Heat transfer and insulation measures to the casing We propose specifications that are processed into shapes suitable for installation locations, such as rectangular, irregular shapes, holes, cutouts, with tabs, and considering assembly and mass production.