【Features】 - Selection of optimal thermal sheets based on application and heat generation conditions (considering thermal conductivity, thickness, hardness, electrical insulation, etc.) - Diverse shape processing tailored to the installation location (rectangular, irregular cutouts, holes, notches, tabbed processing, etc.) - Support for adhesive processing, lamination, and half-cutting, enabling processing that considers assembly processes - Support for sheet supply and roll supply from prototyping to mass production - Addressing thermal challenges at various heat-generating locations such as CPU, GPU, VRAM/HBM, and VRM/MOSFET 【Our Strengths】 Gorin Packing specializes in the punching of soft materials and realizes the "desired shape" of our customers with reliable technology. We provide meticulous support for our customers' manufacturing by considering material selection and prototyping proposals at the design stage, stable procurement from small lots to mass production, and processing accuracy that takes ease of handling on-site into account. We will continue to be a reliable partner for our customers, committed to careful manufacturing.

Punching processing of heat dissipation sheets proposed by Gorin Packing Co., Ltd.

■CPU・GPU: Heat transfer between high-heat components and heat sinks ■GPU peripheral VRAM/HBM: Gap measures between multiple memory and heat sinks ■VRM・MOSFET and other power circuits: Heat dissipation and insulation measures for power circuit components ■SSD and storage peripherals: Heat measures for controllers and NAND, etc. ■Power supply unit and power semiconductors: Heat dissipation measures for high-heat and high-voltage components ■Back of the circuit board, housing, and backplate: Heat transfer and insulation measures to the housing We propose specifications that are processed into shapes suitable for the mounting locations, such as rectangular, irregular shapes, holes, notches, with tabs, and considering assembly and mass production.