【Features】 - Selection of optimal thermal sheets based on application and heat generation conditions - Consideration of thermal conductivity, thickness, hardness/compressibility, electrical insulation, environmental resistance, and reliability - Support for various shape processing such as rectangular and irregular punching, holes and notches, multiple parts, and tabbed processing - Adhesive processing and lamination, as well as half-cut options available - Support for roll supply from prototyping to mass production 【Our Strengths】 Gorin Packing specializes in the punching of soft materials, realizing our customers' "desired shapes" with reliable technology. We support designers with material selection and prototyping suggestions for development. For purchasers, we accommodate small lots to mass production, alleviating concerns about stable procurement and cost. For manufacturers, we contribute to assembly ease and quality improvement with processing precision that considers usability. As a trustworthy partner supporting our customers' manufacturing, we continue to engage in careful craftsmanship.

Heat dissipation sheet punching processing proposed by Olympic Packing Co., Ltd.

■CPU・GPU: Heat transfer between high-heat components and heat sinks ■GPU peripheral VRAM/HBM: Measures for gaps between multiple memory and heat sinks ■VRM, MOSFET, and other power circuits: Heat dissipation and insulation measures for power circuit components ■SSD and storage peripherals: Heat measures for controllers and NAND, etc. ■Power supply unit and power semiconductors: Heat dissipation measures for high-heat and high-voltage components ■Back of the substrate, casing, and backplate: Heat transfer and insulation measures to the casing We propose specifications that are processed into shapes suitable for installation locations, such as rectangular, irregular shapes, holes, notches, tabbed, and laminated, while also considering assembly and mass production.