【Features】 - Selection of heat dissipation sheets according to application and heat generation conditions - Shape processing tailored to the mounting location (square, irregular shapes, holes, notches, etc.) - Supply system capable of supporting everything from prototypes to mass production - Support for secondary processing such as adhesive processing and lamination - Roll supply is also supported, considering integration into automated lines 【Our Strengths】 Gorin Packing specializes in punching soft materials and realizes our customers' "desired shapes" with reliable technology. We flexibly support our customers' manufacturing from material selection assistance at the design stage to small lot and short delivery time responses, as well as mass production. With easy-to-handle processing accuracy, we also contribute to improved assembly efficiency on-site.

Heat dissipation sheet punching processing proposed by Olympic Packing Co., Ltd.

■CPU・GPU: Heat transfer between high-heat components and heat sinks ■GPU peripheral VRAM/HBM: Gap measures between multiple memory and heat sinks ■VRM・MOSFET and other power circuits: Heat dissipation and insulation measures for power circuit components ■SSD and storage peripherals: Heat measures for controllers and NAND, etc. ■Power supply unit and power semiconductors: Heat dissipation measures for high-heat and high-voltage components ■Back of the circuit board, casing, and back plate: Heat transfer and insulation measures to the casing We propose specifications that are processed into shapes suitable for the mounting locations, such as square, irregular shapes, holes, cutouts, with tabs, and laminated, while also considering assembly and mass production.