Heat dissipation sheet processing for power and energy applications
One-stop provision of optimal heat dissipation sheets for inverter cooling.
In the inverter of the power and energy industry, the increase in performance has led to a rise in heat generation, making efficient thermal management a crucial design challenge. In cooling inverters, filling the tiny gaps between heat-generating components and heat sinks, as well as selecting and processing thermal interface materials (TIM) that efficiently conduct heat, are essential for maintaining product reliability. Inadequate thermal management can lead to decreased performance or failure of the inverter. At Gorin Packing, we offer a one-stop solution from selecting thermal interface materials based on heat generation, gaps, and usage environments to shape processing tailored to the installation locations, addressing the thermal challenges of inverters. 【Application Scenarios】 - Cooling of heat-generating areas such as CPUs, GPUs, and power supply units in inverters - Ensuring stable heat dissipation performance in high-power environments - Supporting miniaturization and high-density mounting of devices 【Benefits of Implementation】 - Improved cooling efficiency of inverters - Enhanced product reliability and durability - Streamlined design and manufacturing processes
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【Features】 - Optimal selection of thermal sheets based on application and heat generation conditions (considering thermal conductivity, thickness, hardness/compressibility, electrical insulation, environmental resistance/reliability, etc.) - Precise shape processing tailored to component shapes and assembly processes (square and irregular punching, holes and notches, multiple parts, tab processing, adhesive processing and lamination, half-cutting, etc.) - Supply system capable of handling everything from prototypes to mass production (sheet supply, roll supply) - Consistent support from material selection to shape processing and supply forms - Extensive track record and know-how in punching processing of soft materials 【Our Strengths】 Olin Packing is a company that realizes customers' "desired shapes" with reliable technology, focusing on the punching processing of soft materials. We support development by proposing material selection and prototypes to designers, and assist stable procurement for purchasers with a system capable of handling small lots to mass production. For manufacturers, we contribute to quality improvement on-site with processing precision that considers ease of handling. As a reliable partner supporting our customers' manufacturing, we will continue to engage in careful craftsmanship.
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Heat dissipation sheet punching processing proposed by Olympic Packing Co., Ltd.
Applications/Examples of results
■CPU・GPU: Heat transfer between high-heat components and heat sinks ■GPU peripheral VRAM/HBM: Measures for gaps between multiple memory and heat sinks ■VRM・MOSFET and other power circuits: Heat dissipation and insulation measures for power circuit components ■SSD and storage peripherals: Heat measures for controllers and NAND, etc. ■Power supply unit and power semiconductors: Heat dissipation measures for high-heat and high-voltage components ■Back of the substrate, casing, and backplate: Heat transfer and insulation measures to the casing We propose specifications that are processed into shapes suitable for the mounting locations, such as rectangular, irregular shapes, holes, cutouts, with tabs, and consider assembly and mass production.
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Since our establishment, we have been providing and proposing rapid and accurate packing technologies, regardless of industry or sector. By swiftly strengthening the establishment of a platform revenue base and accommodating various advanced technologies, we have achieved remarkable development. Utilizing indispensable packing technologies, which are often hidden parts of products, we will continue to strive with all our employees to enhance your satisfaction as our motto.