【Features】 - Optimal selection of thermal conductive sheets based on application and heat generation conditions - Consideration of thermal conductivity, thickness, hardness/compressibility, electrical insulation, environmental resistance, and reliability - Support for various shape processing including rectangular and irregular shapes, holes and notches, multiple pieces, and tabbed processing - Adhesive processing and laminating, as well as half-cutting are also possible - Support for roll supply from prototyping to mass production 【Our Strengths】 Gorin Packing specializes in die-cutting of soft materials, realizing our customers' "desired shapes" with reliable technology. We assist designers with material selection and prototyping, provide a system that accommodates small to large production runs for purchasing, and support manufacturing with easy-to-handle processing accuracy. As a trusted partner for our customers, we continue to engage in careful manufacturing.

Heat dissipation sheet punching processing proposed by Gorin Packing Co., Ltd.

■CPU・GPU: Heat transfer between high heat-generating components and heat sinks ■GPU peripheral VRAM/HBM: Gap measures between multiple memory and heat sinks ■VRM・MOSFET and other power circuits: Heat dissipation and insulation measures for power circuit components ■SSD and storage peripherals: Heat measures for controllers and NAND, etc. ■Power supply unit and power semiconductors: Heat dissipation measures for high heat-generating and high voltage components ■Back of the substrate, casing, and back plate: Heat transfer and insulation measures to the casing We propose specifications that are processed into shapes suitable for the mounting locations, such as rectangular, irregular shapes, holes, cutouts, with tabs, and also consider assembly and mass production.