【Features】 - Optimal selection of thermal conductive sheets based on application and heat generation conditions (considering thermal conductivity, thickness, hardness/compressibility, electrical insulation, environmental resistance, etc.) - Diverse processing tailored to component shapes and assembly processes (rectangular and irregular punching, holes and notches, multiple part extraction, tabbed processing, adhesive processing and lamination, half-cutting, etc.) - Supply system capable of supporting everything from prototypes to mass production (sheet supply, roll supply) - Consistent support from material selection to shape processing and supply form - Technical expertise in punching soft materials 【Our Strengths】 Olympic Packing is a company that realizes customers' "desired shapes" with reliable skills, focusing on the punching of soft materials. We respond flexibly to inquiries ranging from precision processing to prototypes and short delivery times. For designers, we support development with material selection and prototype proposals, while for purchasers, we alleviate concerns about stable procurement and costs with a system capable of handling small lots to mass production. For manufacturers, we contribute to improved assembly and quality on-site with processing precision that considers ease of handling. As a "reliable partner" that quietly supports our customers' manufacturing, we will continue to engage in careful production.

Punching processing of heat dissipation sheets proposed by Gorin Packing Co., Ltd.

■CPU・GPU: Heat transfer between high-heat-generating components and heat sinks ■GPU peripheral VRAM/HBM: Gap measures between multiple memory and heat sinks ■VRM・MOSFET and other power circuits: Heat dissipation and insulation measures for power circuit components ■SSD and storage peripherals: Heat measures for controllers and NAND, etc. ■Power supply unit and power semiconductors: Heat dissipation measures for high-heat and high-voltage components ■Back of the circuit board, casing, and backplate: Heat transfer and insulation measures to the casing We propose specifications that are processed into shapes suitable for the mounting locations, such as rectangular, irregular shapes, holes, notches, with tabs, and also consider assembly and mass production.