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SEMICON Japan 2023【HIWIN】

ハイウィン

ハイウィン

We will be exhibiting at "SEMICON Japan 2023," which will be held at Tokyo Big Sight from December 13, 2023. ◇ Event Period December 13 (Wed) - 15 (Fri), 2023, 10:00 - 17:00 ◇ Exhibition Venue Tokyo Big Sight ◇ Booth Number East Hall 2, 2309 ◇ Featured Exhibits ■ Semiconductor Subsystem Solutions We develop and manufacture a wide range of products from mechanical component parts to mechatronic products. In addition to stainless steel linear guideways "MG Series" and ball screws "Super S Series" suitable for the semiconductor and FPD industries, we also offer wafer transport robots, EFEM, wafer aligners, and ultra-precision stages at the nano level. At this exhibition, we will showcase mechanical component parts such as stainless steel linear guideways and ball screws optimal for the semiconductor industry, as well as wafer transport robots, wafer aligners, and wafer load/unload systems. The wafer load/unload system is equipped with a double-arm wafer transport robot and wafer aligner. It is a compact model that contributes to improved space efficiency and work efficiency.

HIWIN Exhibits at SEMICON Japan 2023
Highwin Semiconductor Subsystem Solution
  • Date and time Wednesday, Dec 13, 2023 ~ Friday, Dec 15, 2023
    10:00 AM ~ 05:00 PM
  • Capital Tokyo Big Sight East Hall 2, 2309
  • Entry fee Free Please register for attendance and the seminar using the details and application button below.

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