We will be exhibiting at the "39th Internepcon Japan/Electronics Manufacturing and Assembly Exhibition" held at Tokyo Big Sight from January 22, 2025. ◇ Event Period January 22 (Wed) to 24 (Fri), 2025, 10:00 AM to 5:00 PM ◇ Exhibition Venue Tokyo Big Sight ◇ Booth Number East Hall 2 E11-8 ◇ Featured Exhibits ■ N2 Nano Precision Stage A precision stage capable of positioning at the nanoscale. Ideal for the semiconductor industry, which requires high precision! Positioning stability is ±2nm. High-speed stability at 100mm/s is ±0.1%. With a low-profile and stable structure, it can be utilized in high-end precision inspection equipment. Our company develops, proposes, sells, and maintains a wide range of products, including linear motion products with world-class market share, precision instruments related to motion control, and industrial robots. At this exhibition, we will propose subsystems that go beyond components for the semiconductor, LED, and FPD industries. We will showcase mechanical components such as stainless steel linear guideways and ball screws, wafer transport systems, and ultra-thin DDD motors, which are optimal for the semiconductor industry.

We will be exhibiting at the "38th Internepcon Japan/Electronics Manufacturing and Assembly Exhibition" to be held at Tokyo Big Sight from January 24, 2024. ◇ Event Period January 24 (Wednesday) to 26 (Friday), 2024, 10:00 AM to 5:00 PM ◇ Exhibition Venue Tokyo Big Sight ◇ Booth Number East Hall 1, E3-18 ◇ Featured Exhibits ■ Semiconductor Subsystem Solutions We develop and manufacture a wide range of products from mechanical component parts to mechatronic products. In addition to stainless steel linear guideways "MG Series" and ball screws "Super S Series" suitable for the semiconductor and FPD industries, we also offer wafer transport robots, EFEM, wafer aligners, and ultra-precision stages at the nano level. At this exhibition, we will showcase mechanical component parts such as stainless steel linear guideways and ball screws optimal for the semiconductor industry, wafer transport robots, wafer aligners, and wafer load/unload systems. The wafer load/unload system is equipped with a double-arm wafer transport robot and a wafer aligner. It is a compact model that contributes to improved space efficiency and work efficiency.

We will be exhibiting at "SEMICON Japan 2023," which will be held at Tokyo Big Sight from December 13, 2023. ◇ Event Period December 13 (Wed) - 15 (Fri), 2023, 10:00 - 17:00 ◇ Exhibition Venue Tokyo Big Sight ◇ Booth Number East Hall 2, 2309 ◇ Featured Exhibits ■ Semiconductor Subsystem Solutions We develop and manufacture a wide range of products from mechanical component parts to mechatronic products. In addition to stainless steel linear guideways "MG Series" and ball screws "Super S Series" suitable for the semiconductor and FPD industries, we also offer wafer transport robots, EFEM, wafer aligners, and ultra-precision stages at the nano level. At this exhibition, we will showcase mechanical component parts such as stainless steel linear guideways and ball screws optimal for the semiconductor industry, as well as wafer transport robots, wafer aligners, and wafer load/unload systems. The wafer load/unload system is equipped with a double-arm wafer transport robot and wafer aligner. It is a compact model that contributes to improved space efficiency and work efficiency.

We will be exhibiting at the "Photonix/Photon and Laser Technology Exhibition" held at Makuhari Messe from October 4, 2023. ◇ Event Period October 4 (Wednesday) to 6 (Friday), 2023, 10:00 AM to 6:00 PM (*On the last day, until 5:00 PM) ◇ Exhibition Venue Makuhari Messe ◇ Booth Number Hall 8, No. 49-18 ◇ Featured Exhibits ■ Ultra-thin DD Motor [DMT Series] We will start accepting orders and sales for the new large-diameter type "DMTK3" of the industry’s thinnest class DD motor [DMT Series] from June 2023. With a hollow diameter of 340mm and a thickness of 30mm, it is compatible with 4-12 inch wafers. It is suitable for use in semiconductor manufacturing processes and AOI inspection equipment that require high precision. Additionally, the expanded hollow diameter compared to the conventional lineup allows for more flexible equipment design. The ultra-thin compactness and the hollow diameter that can accommodate cables and air piping also enable the reduction of stage design and assembly man-hours for equipment manufacturers. We will also exhibit "Wafer Transport Robots" and "Wafer Aligners," which incorporate our components to achieve both affordability and high performance.