39th InterNepCon Japan / Electronics Manufacturing and Assembly Exhibition [HIWIN]

ハイウィン
We will be exhibiting at the "39th Internepcon Japan/Electronics Manufacturing and Assembly Exhibition" held at Tokyo Big Sight from January 22, 2025. ◇ Event Period January 22 (Wed) to 24 (Fri), 2025, 10:00 AM to 5:00 PM ◇ Exhibition Venue Tokyo Big Sight ◇ Booth Number East Hall 2 E11-8 ◇ Featured Exhibits ■ N2 Nano Precision Stage A precision stage capable of positioning at the nanoscale. Ideal for the semiconductor industry, which requires high precision! Positioning stability is ±2nm. High-speed stability at 100mm/s is ±0.1%. With a low-profile and stable structure, it can be utilized in high-end precision inspection equipment. Our company develops, proposes, sells, and maintains a wide range of products, including linear motion products with world-class market share, precision instruments related to motion control, and industrial robots. At this exhibition, we will propose subsystems that go beyond components for the semiconductor, LED, and FPD industries. We will showcase mechanical components such as stainless steel linear guideways and ball screws, wafer transport systems, and ultra-thin DDD motors, which are optimal for the semiconductor industry.


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Date and time Wednesday, Jan 22, 2025 ~ Friday, Jan 24, 2025
10:00 AM ~ 05:00 PM
- Capital Tokyo Big Sight East Hall E11-8
- Entry fee Free Pre-registration is required for attendance. Please check the details and application button for information about registration.