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Example of failure analysis of chip resistors
We would like to introduce an example of failure analysis of chip resistors where abnormalities were observed. Upon investigating the cause of the malfunction of the polishing table, abnormalities we…
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Notice of Relocation
We would like to inform you that we have moved from our previous headquarters in Yasu and our Ritto office to the following new location. Taking this opportunity, we are committed to further developing our business and making every effort to meet your expectations. We kindly ask for your continued support and goodwill. 【New Headquarters Location】 ■ Address: 1-60 Kuribayashi-cho, Otsu City, Shiga Prefecture ■ Phone: 077-599-5015 ■ FAX: 077-544-7710 * The phone numbers for each department remain the same as before. Operations, phone, and fax services at the old location have been discontinued as of August 10 (Wednesday). We apologize for any inconvenience this may cause and appreciate your understanding.
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[Data] Measurement of the birefringence of laminate film
"Laminating film" is used in various industries for the purpose of protecting the display surface while maintaining the visibility of printed materials by utilizing highly transparent materials. During processing, heat bonding is performed, so it is assumed that the molecular state changes compared to before processing. In this study, we attempted to clarify the residual stress remaining in the product by comparing conditions with and without heat applied to the laminating film, using birefringence. This document presents measurement results using a laminating film composed of polyethylene terephthalate (PET) and ethylene-vinyl acetate (EVA) as an example. [Contents] ■ Measurement of glass transition temperature by DSC ■ Measurement of birefringence by WPA ■ Effects of combining PET and EVA You can view related products and catalogs.
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Announcement of the Introduction of FIB-SEM Helios 5 UC
The introduction of the "FIB-SEM Helios 5 UC" is scheduled to start service in November. We will provide shorter delivery times and reliable feedback than before. We will achieve high-throughput cross-sectional observation and analysis of a wide range of materials, from semiconductor devices such as power devices, ICs, solar cells, and light-emitting elements to electronic components like MLCCs and soft materials. With a high-quality beam of up to 100nA, we can process large areas at high speed, and by finishing the FIB at low acceleration, it is possible to produce high-quality samples with minimal damage layers. You can view related products and catalogs.
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Scheduled to give a lecture at the 40th Nano Testing Symposium.
We will participate in the commercial session and commercial exhibition program at the 40th Nano Testing Symposium, which will be held in November 2020. This symposium brings together researchers in the fields of design, process, testing, and design/manufacturing/testing equipment. We will also introduce our latest analytical technology services, so please stop by. Booth: KFC Hall Annex (3F) No.3 [on the right side upon entry] We look forward to your participation.
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Notice of the 6th Seminar of the Advanced Power Semiconductor Subcommittee
A seminar will be held on topics related to crystal growth of power semiconductors, fundamental property evaluation, process technology, devices, and equipment applications. We will also introduce our latest analysis services at the poster session and company exhibition booth, so please feel free to stop by. Booth: Large Conference Room Dahlia E07 We look forward to your participation.