Solder Heat Resistance Test (SMD)

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Our company conducts solder heat resistance tests to evaluate the heat resistance of surface mount devices (SMD) during the solder mounting process. We replicate moisture absorption before mounting through humidification treatment and assess the presence of delamination or cracks through heating treatment that corresponds to the thermal stress during solder mounting. Additionally, as part of the post-test inspection, we perform inspections identical to the initial measurements and, if necessary, conduct analyses such as cross-sectional observations of defective parts. For more detailed information, please refer to the related products and catalogs.

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Related product information

Analysis of the assembly joints of the implemented components
By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

■Mechanical polishing of the substrate bonding area + Chemical etching + Ion milling Observation using optical microscope and SEM ■Cross-section creation using FIB Observation using SEM
Total Support Service for Reliability
We conduct environmental testing, as well as non-destructive observation and electrical property measurements.

For more details, please refer to the PDF document or feel free to contact us.
Cross-sectional observation pre-treatment (sample cutting and resin embedding)
We will introduce the pre-treatment for cross-sectional observation using devices for sample cutting, such as band saws!

For more details, please refer to the PDF document or feel free to contact us.
Cross-sectional polishing service for implementation parts and electronic components.
Each part is carefully polished by hand, using an efficient process without waste!

For more details, please refer to the PDF document or feel free to contact us.
Surface mount electronic component cross-sectional observation service
You can closely observe the solder joint condition of electronic components on the implementation board and the internal structure of the components!

For more details, please refer to the PDF document or feel free to contact us.