Total Support Service for Reliability
We conduct environmental testing, as well as non-destructive observation and electrical property measurements.
At AITES, we use environmental testing equipment that conforms to standard specifications such as JIS, JEDEC, and MIL, and we accept commissioned testing for reliability evaluation of various electronics products, components, and materials. We offer a range of tests including electrical testing, non-destructive observation, and power cycle testing. 【Environmental Testing】 ■ Highly Accelerated Life Testing ■ Constant Temperature and Humidity Testing ■ Thermal Shock Testing ■ Liquid Bath Thermal Shock Testing ■ Temperature and Humidity Cycle Testing ■ In-Situ Continuous Measurement Reliability Evaluation Testing Service *For more details, please refer to the PDF materials or feel free to contact us.
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Appearance observation and measurement services
We would like to introduce our "Appearance Observation and Measurement Service." We are equipped with a variety of devices to meet your needs, including appearance observation before and after reliability testing, solder joint observation, as well as dimensional measurements and surface roughness measurements of various components. You can also leave the pre-observation processing to us. Our company has IPC-certified IPC specialists on staff. We provide assistance with observations, consultations, and solutions to various observation-related concerns in accordance with international standards.
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Evaluation of various implementation substrates
At Aites Co., Ltd., we provide a wide range of technical services for evaluation tests of printed circuit boards (mounted boards) equipped with electronic components. We conduct reliability tests, solder joint observations, whisker observations, and cross-sectional observations. We have IPC-A-610 certified IPC specialists on staff who can assist with observations in accordance with international standards, consultations, and various observation-related concerns. Additionally, we offer services such as X-ray observations, appearance inspections, and shape measurements, so please feel free to consult with us when needed.
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In-chamber imaging during constant temperature and humidity testing.
Our company conducts environmental testing using a constant temperature and humidity chamber with a front glass window and a camera, allowing us to capture and monitor the operational status, such as screen displays, during the tests. During environmental testing using equipment like constant temperature and humidity chambers, monitoring the condition of the test subjects with loggers (for voltage, current, resistance, temperature, etc.) is widely practiced. However, monitoring the operational status of equipment during testing can be difficult unless the test equipment is equipped with dedicated external outputs. For samples where monitoring with loggers is challenging, we combine a constant temperature and humidity chamber with a front glass window option, a camera, and monitoring software to conduct environmental tests while capturing and monitoring the condition of the test equipment.
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IOL testing of discrete semiconductors
Our company conducts "IOL testing of discrete semiconductors." We repeatedly turn the power ON/OFF in a room temperature environment, applying stress to the device due to temperature changes caused by the device's own heat generation during power ON. During power OFF (cooling), forced cooling is also performed using a fan. Additionally, before conducting the tests, we use representative samples to make adjustments to reach the test temperature conditions. It is possible to adjust the current/time during heating and the fan capacity/timing during cooling.
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Strain measurement in thermal shock testing.
We would like to introduce the "strain measurement in thermal shock testing" conducted by our company. A sample with strain gauges attached was set up in the thermal shock testing device, and the wiring of the strain gauges was connected to an external data logger to record strain data in real time during the test. For two types of copper-clad laminates, the strain behavior during the thermal shock test was observed, and it was noted that significant strain occurred with changes in temperature. It was found that FR-1 exhibited greater strain compared to FR-4.
