All products and services
181～210 item / All 352 items
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Cross-sectional observation by SEM: Connector plating
Exploring the truth! If the communication worsens, it might be worth considering a malfunction in the connector terminal.
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Regarding the curing temperature of epoxy resin during sample encapsulation.
Even with larger-sized implementation boards, resin embedding is possible without cutting before embedding! We will introduce cases with and without heat generation prevention treatment.
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Melt Flow Rate (MFR) Measurement Evaluation Service
Leave it to us for everything from chemical analysis and physical testing to reliability testing! Introduction to our measurement and evaluation services.
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We handle everything from reliability testing of materials to chemical analysis.
We will solve your problems and issues with our expertise and abundant equipment!
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Evaluation of BGA/CSP solder
Measuring the area ratio of internal voids in solder! By combining mechanical polishing, a comprehensive evaluation is possible.
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FE-SEM observation (Crystal grain observation of Al wire bonding section)
High-brightness electron gun for detailed SEM images! Equipped with an in-lens SE detector sensitive to surface information.
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[Example of analysis using EBSD] Silicon wafer
The measured silicon wafer is single crystal! The IPF map, pole figure, and inverse pole figure resulted in relatively simple outcomes.
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Surface analysis of discolored and altered materials using XPS (ESCA).
Measures and avoidance of issues are possible! We will introduce examples verified through elemental and bonding state analysis.
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Surface Analysis Guide
Various surface analysis techniques! We will assist you in solving issues such as foreign substances, discoloration, and contamination.
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[Data] EPMA Analysis Example 2
Analysis by EPMA can detect PET and PETH spectral crystals, allowing for peak separation of 17Cl and 47Ag!
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[Data] Structural Analysis of MEMS Components
Comprehensive analysis of the structure of MEMS components using a combination of non-destructive and destructive methods!
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Analysis of polymerization initiators in light-curing resins.
Analyze trace components in materials using thermal desorption GCMS! We perform characterization of various materials.
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[Data] FT-IR Analysis of Transparent Resin
Introducing the results of IR analysis on peripheral materials for LCD displays and raw materials (pellets) such as fibers!
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[Data] Degradation Analysis of Polarizing Film and Light Diffusing Film
Introducing the usage samples along with their characteristics and the degradation analysis results of polarizing films and light diffusion films!
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Authenticity investigation (comparative observation)
Compare the genuine or standard products with the items under investigation! Investigate whether there have been any silent changes, etc.
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[Data] IR analysis of vinyl polymers (resin materials)
Introducing the results of IR analysis conducted on polystyrene, polyvinyl chloride (PVC), and others!
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Simple measurement of band gap using XPS.
It is possible to measure simply using XPS! Please inquire about semiconductors other than oxide-based ones.
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[Information] We will solve the cause of the issue from a chemical perspective.
Solve the cause of the problem from a chemical perspective! Introducing methods to approach it through chemistry and reaction mechanisms.
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Analysis of pigments and polymers using MALDI-TOFMS.
Detect the mass number as an absolute value! You can obtain information about the composition of the compound.
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Structural analysis of Nylon 6.10
We will elucidate the characteristics at the molecular level using our FT-IR and thermal decomposition GC-MS!
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Identification of failure locations in electronic components through thermal analysis.
It is possible to perform non-destructive testing from fault location identification to internal observation! High-precision identification of heat generation areas can be achieved.
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[Example of TOF-SIMS] Analysis of Li
It is possible to detect with high sensitivity! We will introduce a case comparing the analysis of Li using TOF-SIMS and SEM-EDX.
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X-ray observation of electrolytic capacitors
We conducted visual inspections and internal observations using X-ray CT for normal products and degraded products!
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Observation of diamond clarity
A microscope allows you to observe tiny defects that cannot be seen with the naked eye!
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Evaluation of distortion and birefringence of products/materials by WPA.
By evaluating the orientation, strain, and birefringence of the material, you can understand the internal stress and strain state!
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FT-IR analysis of polyethylene
Analyze subtle spectral differences using FT-IR! We can also accommodate reliability tests combined with high temperature, cold heat, and more.
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Oblique CT observation of the laminated substrate.
In a multilayer substrate, it is possible to obtain information for each layer! By using a length measurement tool, you can measure the length.
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Measurement of solder crack rate by cross-sectional observation.
Calculating the crack rate of ball joints and implementing it according to customer specifications!
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Characterization of materials using a ultra-micro hardness tester.
From the load-displacement curve of ultra-microhardness measurement, the characteristics of various materials become apparent!
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Ion Chromatography Analysis Case (Solid Surface)
Suitable for relative comparison of flat samples such as printed circuit boards! Introducing the analysis flow of liquid samples and solid surfaces.
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