In-line pressure sensor 6152A
A robust structure without a diaphragm, capable of accommodating a wide measurement range!
The 6152A series crystal piezoelectric type internal pressure sensor measures the internal pressure of plastic injection molding up to a maximum of 2,000 bar. Since there is no diaphragm at the tip, it can be machined up to 0.5mm to fit the shape of the mold's inner surface. The connection cable is replaceable. －＊ Features ＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－ • Ideal for industrial use • Machining at the tip is possible up to 0.5mm (except for tip-coated types) • Replaceable cable
basic information
6152A... is an adapter added to the quartz piezoelectric sensor 6157B.... The diameter of 6157BA... fits into the adapter with a gap of approximately 10 microns, and it directly receives the pressure within the mold, transmitting it to the quartz element, which generates a charge that is accurately proportional to the pressure. This charge is converted into voltage by a charge amplifier (sold separately). All components are made of corrosion-resistant materials. The cable is sealed, and the connector part is treated to be splash-resistant.
Price range
Delivery Time
Model number/Brand name
6152AA,6152AC,6152AAA,6152ACA,6152AB,6152AD
Applications/Examples of results
It is ideal for monitoring and controlling the molding of thermoplastic resins, elastomers, thermosetting resins, and SMC. For filled resins such as glass or carbon fiber, thermosetting resins, and abrasive materials like SMC, we recommend 6152AC... or 6152AD... with a hard coating on the tip. Additionally, for low-viscosity materials such as thermosetting resins and epoxies, please use 6152AAA... or 6152ACA... with silicone filled in the gap between the sensor and the adapter to prevent material intrusion.
Line up（6）
| Model number | overview |
|---|---|
| 6152AA | Operating temperature range Resin (sensor tip): <450℃ Mold (sensor, cable): 200℃ |
| 6152AC | Tip coating process applied to 6152AA |
| 6152AAA | Silicone filling process applied to 6152AA |
| 6152ACA | Silicone filling process applied to 6152AC |
| 6152AB | Uses a metal mesh protected Kapton insulated cable Operating temperature range Resin (sensor tip): <450℃ Mold (sensor, cable): 300℃ |
| 6152AD | Tip coating process applied to 6152AB |
catalog（3）
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News about this product（11）
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Announcement of a free webinar: Semiconductor resin encapsulation molding "Visualization solutions for inside the mold" and IoT technology (4/27)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (New Energy Vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins like epoxy transfer molding and for low-pressure measurements. - Compatible with low-viscosity resins ⇒ Structure that does not cause measurement errors due to the intrusion of epoxy resin (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% relative to the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held three times on the following dates, but the content will be the same for all sessions, so please feel free to join on a date that suits you! April 27, 2022 (Wednesday) May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register using the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.
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Announcement of Free Webinar: Semiconductor Resin Encapsulation Molding "Visualization Solutions Inside Molds" and IoT Technology (5/18)
In the semiconductor industry, especially in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins, such as epoxy transfer molding, and for low-pressure measurements. - Compatible with low-viscosity resins ⇒ Structure that does not produce measurement errors due to resin intrusion (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% for the measurement range - Resolution ⇒ 1/1,000 MPa May 18, 2022 (Wednesday) Please check the details and register using the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to the participation of many people.
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Announcement of a free webinar: Semiconductor resin encapsulation molding "Visualization solutions for the inside of molds" and IoT technology (May 11)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is a growing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins, such as epoxy transfer molding, and for low-pressure measurements. - Low-viscosity resin compatibility ⇒ Structure that does not produce measurement errors due to epoxy resin intrusion (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% against the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held twice on the following dates, but the content will be the same for both sessions, so please feel free to join on the date that is most convenient for you! May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register via the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.
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Announcement of Free Webinar: Semiconductor Resin Molding "Visualization Solutions Inside the Mold" and IoT Technology (April 20)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low viscosity resins, such as epoxy transfer molding, and for low-pressure measurements. - Low viscosity resin compatibility ⇒ Structure that does not cause measurement errors due to epoxy resin intrusion (diaphragm structure) - High temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% relative to the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held four times on the following dates, but the content will be the same for all sessions, so please join us on a date that suits you! April 20, 2022 (Wednesday) April 27, 2022 (Wednesday) May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register using the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.
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Announcement of Free Webinar: Semiconductor Resin Encapsulation Molding "Visualization Solutions for Inside Molds" and IoT Technology (4/20, 4/27, 5/11, 5/18)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins, such as epoxy transfer molding, and for low-pressure measurements. - Low-viscosity resin compatibility ⇒ Structure that does not cause measurement errors due to epoxy resin intrusion (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% against the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held on the following four dates, but the content will be the same on all dates, so please join us on a day that suits you! April 20, 2022 (Wednesday) April 27, 2022 (Wednesday) May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register via the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.
