Direct-type internal pressure sensor, tip diameter 2.5mm, 6182D
Pressure sensors supporting the internal pressure monitoring systems spreading in the home appliance industry.
Our in-mold pressure sensor, which has primarily been used for measuring and monitoring in-mold pressure of automotive-related molded parts, along with our monitoring system "ComoNeo," is now also being adopted in the home appliance industry. Efforts to improve productivity through in-mold pressure monitoring of products such as air conditioners and washing machines are expanding. The 6182D series in-mold pressure sensor measures in-mold pressure for plastic injection molding up to 2,000 bar, making it suitable for various molded products. Additionally, using the monitoring system "ComoNeo" allows for the quantification of the molding process. (Please refer to the catalog below for more information on "ComoNeo.") Currently, we are also accepting applications for online meetings. If you are interested, please feel free to contact us via the inquiry button. 【Features】 • Uses single wire cable • No diaphragm, allowing for tip processing (standard type) • Tip coating (optional) • Cable replacement available
basic information
The cable section of the 6182D with a tip diameter of Φ2.5mm is a single wire, has a very small cross-section, and is flexible. Installation requires the use of a mounting plate, and it must be securely fixed to prevent the connector part from loosening. For multiple units, a multi-connector (model 1708B0, 1710B0) is used. When the sensor tip directly receives the pressure inside the mold and transmits it to the quartz element, a charge proportional to the pressure is generated (pC = picocoulombs). This charge is converted into voltage (0-10V) by a charge amplifier (sold separately).
Price range
Delivery Time
Model number/Brand name
6182D
Applications/Examples of results
It is mainly suitable for open-loop and closed-loop control in industrial monitoring and injection molding of thermoplastic resins.
Detailed information
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Announcement of a free webinar: Semiconductor resin encapsulation molding "Visualization solutions for inside the mold" and IoT technology (4/27)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (New Energy Vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins like epoxy transfer molding and for low-pressure measurements. - Compatible with low-viscosity resins ⇒ Structure that does not cause measurement errors due to the intrusion of epoxy resin (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% relative to the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held three times on the following dates, but the content will be the same for all sessions, so please feel free to join on a date that suits you! April 27, 2022 (Wednesday) May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register using the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.
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In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is a growing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins, such as epoxy transfer molding, and for low-pressure measurements. - Low-viscosity resin compatibility ⇒ Structure that does not produce measurement errors due to epoxy resin intrusion (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% against the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held twice on the following dates, but the content will be the same for both sessions, so please feel free to join on the date that is most convenient for you! May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register via the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.
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Announcement of Free Webinar: Semiconductor Resin Molding "Visualization Solutions Inside the Mold" and IoT Technology (April 20)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low viscosity resins, such as epoxy transfer molding, and for low-pressure measurements. - Low viscosity resin compatibility ⇒ Structure that does not cause measurement errors due to epoxy resin intrusion (diaphragm structure) - High temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% relative to the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held four times on the following dates, but the content will be the same for all sessions, so please join us on a date that suits you! April 20, 2022 (Wednesday) April 27, 2022 (Wednesday) May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register using the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.
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Announcement of Free Webinar: Semiconductor Resin Encapsulation Molding "Visualization Solutions for Inside Molds" and IoT Technology (4/20, 4/27, 5/11, 5/18)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins, such as epoxy transfer molding, and for low-pressure measurements. - Low-viscosity resin compatibility ⇒ Structure that does not cause measurement errors due to epoxy resin intrusion (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% against the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held on the following four dates, but the content will be the same on all dates, so please join us on a day that suits you! April 20, 2022 (Wednesday) April 27, 2022 (Wednesday) May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register via the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.