Direct type internal pressure sensor, tip diameter 1mm, 6183C
Compact sensor with a tip diameter of Φ1mm!
The 6183C series in-mold pressure sensor measures in-mold pressure during plastic injection molding up to 2,000 bar. －＊ Features ＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－ • Uses single-wire cable • Capable of tip processing due to the absence of a diaphragm (standard type) • Tip coating (optional) • Replaceable cable
basic information
The cable section of the 6183C with a tip diameter of Φ1mm is made of a single wire, has a very small cross-section, and is flexible. Installation requires the use of a mounting plate to securely fix the connector part to prevent it from loosening. When the sensor's tip directly receives pressure within the mold and transmits it to the quartz element, a charge proportional to the pressure is generated (pC = picocoulombs). This charge is converted into voltage (0-10V) by a charge amplifier (sold separately).
Price range
Delivery Time
Model number/Brand name
6183CA,6183CC
Applications/Examples of results
It is mainly suitable for open-loop and closed-loop control in industrial monitoring and injection molding of thermoplastic resins.
Line up（2）
| Model number | overview |
|---|---|
| 6183CA | Standard Type |
| 6183CC | Tip Coating Type |
catalog（3）
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News about this product（12）
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Announcement of a free webinar: Semiconductor resin encapsulation molding "Visualization solutions for inside the mold" and IoT technology (4/27)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (New Energy Vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins like epoxy transfer molding and for low-pressure measurements. - Compatible with low-viscosity resins ⇒ Structure that does not cause measurement errors due to the intrusion of epoxy resin (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% relative to the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held three times on the following dates, but the content will be the same for all sessions, so please feel free to join on a date that suits you! April 27, 2022 (Wednesday) May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register using the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.
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Announcement of Free Webinar: Semiconductor Resin Encapsulation Molding "Visualization Solutions Inside Molds" and IoT Technology (5/18)
In the semiconductor industry, especially in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins, such as epoxy transfer molding, and for low-pressure measurements. - Compatible with low-viscosity resins ⇒ Structure that does not produce measurement errors due to resin intrusion (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% for the measurement range - Resolution ⇒ 1/1,000 MPa May 18, 2022 (Wednesday) Please check the details and register using the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to the participation of many people.
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Announcement of a free webinar: Semiconductor resin encapsulation molding "Visualization solutions for the inside of molds" and IoT technology (May 11)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is a growing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins, such as epoxy transfer molding, and for low-pressure measurements. - Low-viscosity resin compatibility ⇒ Structure that does not produce measurement errors due to epoxy resin intrusion (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% against the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held twice on the following dates, but the content will be the same for both sessions, so please feel free to join on the date that is most convenient for you! May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register via the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.
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Announcement of Free Webinar: Semiconductor Resin Molding "Visualization Solutions Inside the Mold" and IoT Technology (April 20)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low viscosity resins, such as epoxy transfer molding, and for low-pressure measurements. - Low viscosity resin compatibility ⇒ Structure that does not cause measurement errors due to epoxy resin intrusion (diaphragm structure) - High temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% relative to the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held four times on the following dates, but the content will be the same for all sessions, so please join us on a date that suits you! April 20, 2022 (Wednesday) April 27, 2022 (Wednesday) May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register using the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.
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Announcement of Free Webinar: Semiconductor Resin Encapsulation Molding "Visualization Solutions for Inside Molds" and IoT Technology (4/20, 4/27, 5/11, 5/18)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins, such as epoxy transfer molding, and for low-pressure measurements. - Low-viscosity resin compatibility ⇒ Structure that does not cause measurement errors due to epoxy resin intrusion (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% against the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held on the following four dates, but the content will be the same on all dates, so please join us on a day that suits you! April 20, 2022 (Wednesday) April 27, 2022 (Wednesday) May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register via the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.
