Direct type internal pressure sensor, tip diameter 9mm, 6161A
Ideal for low-viscosity plastics and resins!
The in-mold pressure sensor 6161AA measures in-mold pressure during plastic injection molding up to a maximum of 200 bar. It is suitable for low-viscosity plastics and resins. -* Features *-*-*-*-*-*-*-*-*-*-*-*-*- • Ideal for industrial applications such as high-pressure RTM molding • Structure with a diaphragm • Seals the gap between the mounting hole and the sensor using an O-ring • Integrated screw-type structure • Cable is replaceable
basic information
The internal pressure sensor 6161AA features a structure with a Φ4mm diaphragm, welded into a robust Φ9mm cartridge. Even if low-viscosity materials intrude into the sensor mounting hole gap, it does not affect sensitivity. The installation of an O-ring also allows for negative pressure measurement during decompression. The pressure received by the diaphragm at the sensor tip is transmitted to a quartz element, generating a charge (pC) that is accurately proportional to the pressure. This charge is converted into voltage by a charge amplifier (sold separately). The cable is replaceable.
Price range
Delivery Time
Model number/Brand name
6161A
Applications/Examples of results
It is particularly suitable for monitoring and control in the automotive industry and aerospace industry, including resin transfer molding (RTM), high-pressure resin transfer molding (HP-RTM), and sheet molding compound (SMC). It is also suitable for low-viscosity plastic products such as silicone (LSR) and elastomers.
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Announcement of a free webinar: Semiconductor resin encapsulation molding "Visualization solutions for inside the mold" and IoT technology (4/27)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (New Energy Vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins like epoxy transfer molding and for low-pressure measurements. - Compatible with low-viscosity resins ⇒ Structure that does not cause measurement errors due to the intrusion of epoxy resin (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% relative to the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held three times on the following dates, but the content will be the same for all sessions, so please feel free to join on a date that suits you! April 27, 2022 (Wednesday) May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register using the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.
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Announcement of Free Webinar: Semiconductor Resin Encapsulation Molding "Visualization Solutions Inside Molds" and IoT Technology (5/18)
In the semiconductor industry, especially in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins, such as epoxy transfer molding, and for low-pressure measurements. - Compatible with low-viscosity resins ⇒ Structure that does not produce measurement errors due to resin intrusion (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% for the measurement range - Resolution ⇒ 1/1,000 MPa May 18, 2022 (Wednesday) Please check the details and register using the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to the participation of many people.
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Announcement of a free webinar: Semiconductor resin encapsulation molding "Visualization solutions for the inside of molds" and IoT technology (May 11)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is a growing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins, such as epoxy transfer molding, and for low-pressure measurements. - Low-viscosity resin compatibility ⇒ Structure that does not produce measurement errors due to epoxy resin intrusion (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% against the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held twice on the following dates, but the content will be the same for both sessions, so please feel free to join on the date that is most convenient for you! May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register via the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.
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Announcement of Free Webinar: Semiconductor Resin Molding "Visualization Solutions Inside the Mold" and IoT Technology (April 20)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low viscosity resins, such as epoxy transfer molding, and for low-pressure measurements. - Low viscosity resin compatibility ⇒ Structure that does not cause measurement errors due to epoxy resin intrusion (diaphragm structure) - High temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% relative to the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held four times on the following dates, but the content will be the same for all sessions, so please join us on a date that suits you! April 20, 2022 (Wednesday) April 27, 2022 (Wednesday) May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register using the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.
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Announcement of Free Webinar: Semiconductor Resin Encapsulation Molding "Visualization Solutions for Inside Molds" and IoT Technology (4/20, 4/27, 5/11, 5/18)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins, such as epoxy transfer molding, and for low-pressure measurements. - Low-viscosity resin compatibility ⇒ Structure that does not cause measurement errors due to epoxy resin intrusion (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% against the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held on the following four dates, but the content will be the same on all dates, so please join us on a day that suits you! April 20, 2022 (Wednesday) April 27, 2022 (Wednesday) May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register via the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.