Visualization solution for the interior of molds in semiconductor resin encapsulation.
We propose improvements to the quality and production efficiency of package molding, where issues become apparent!
There is a trend in the automotive semiconductor industry, particularly in power semiconductors, to quantify the internal conditions of molds, which can be considered a black box, during the resin encapsulation process. This trend is driven by the emergence of issues related to moldability due to the miniaturization and thinning of semiconductor packages and the fine pitch. As a countermeasure, there is a growing need to improve productivity and quality through actual measurements of resin filling pressure and temperature within the mold cavity during package molding. In response to this need, Kistler proposes a "visualization solution for the interior of the mold" using high-performance quartz piezoelectric in-mold pressure sensors to measure resin filling pressure and temperature.
basic information
One of Kissler's core technologies is the adoption of a piezoelectric crystal in-mold pressure sensor, optimized for semiconductor resin encapsulation, with the following features: - Low viscosity resin compatibility ⇒ Structure that prevents measurement errors due to epoxy resin intrusion (diaphragm structure) - High-temperature compatibility for semiconductor resins ⇒ Mold temperature up to 200°C - Durability ⇒ Semi-permanent - Linearity (measurement error) ⇒ Guarantees less than 1% for the measurement range - Resolution ⇒ 1/1000 MPa The "visualization of the inside of the mold" in semiconductor resin encapsulation is a proposed solution to challenges arising from recent demands for miniaturization and thinness in semiconductor packaging. In particular, the rapid expansion of electric vehicles (EVs) has increased the demand for power semiconductors for automobiles, making the improvement of quality in resin-encapsulated packages, as well as enhancements in production efficiency and inspection costs, significant challenges. In addition to traditional software-based flow analysis, measuring and quantifying the in-mold pressure and temperature within the mold cavity using sensors has been recognized as an effective solution, and its adoption has already begun in actual manufacturing lines.
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Applications/Examples of results
◇Homogenization during Mass Production By continuously monitoring the temperature of the mold and cavity in addition to the internal pressure, correlation analysis with defects becomes possible. Example) Temperature rise: As the viscosity of the resin increases, flowability decreases, leading to increased shear stress on the bonding wire, which can cause deformation. This is also directly linked to the cause of short shots (insufficient filling). In this case, the maximum internal pressure decreases, and the curing speed increases. Example) Temperature drop: As the viscosity of the resin decreases, flowability increases, which can lead to burr formation. In this case, the maximum internal pressure increases, and the curing speed decreases. ◇Prevention of Chip Cracks (Monitoring Release Force) By installing a force sensor under the ejector pin, it becomes possible to evaluate release properties, providing a basis for determining maintenance timing. Example) Repeated continuous molding can cause the release agent to oxidize and degrade, increasing the release force, which in turn increases the load on the molded product and can lead to chip cracks. A quartz piezoelectric type can detect instantaneous protruding forces. ◇Visualization of Filling Balance for Multiple Cavities Monitoring the uniformity when there are multiple cavities in the mold. ◇Improvement of R&D By comparing the results of flow analysis with actual measured values, it is possible to reassess the accuracy of flow analysis.
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Invitation to a Private Seminar on Semiconductor Resin Encapsulation
We are pleased to announce that Kistler Japan will be holding a private seminar on semiconductor resin encapsulation tailored to our customers' requests! [Title] "Visualization Solutions for the Interior of Molds" in Semiconductor Resin Encapsulation and IoT Technology [Date and Time] Weekdays from 10:00 AM to 5:00 PM (at the customer's preferred time) Available in both web and in-person formats [Duration] 1 to 1.5 hours [Application] Please let us know your preferences through the inquiry form on our company website. In this seminar, we will use CG videos to quantify the internal state of molds, often referred to as a black box, using the semiconductor encapsulation process as an example. We will provide detailed insights into improving major molding defects and enhancing production processes. [Effectiveness of Mold Interior Visualization] - Improvement of R&D - Homogenization during mass production - Visualization of filling balance for multiple cavities We will also propose sensing technologies and IoT solutions to improve molding defects using quartz piezoelectric sensors, which are effective for low-pressure measurements like epoxy transfer molding. The content is also applicable to injection molding cavity pressure monitoring, so interested customers are encouraged to contact us freely.
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Webinar (2/25): This week! "Visualization Solutions for Mold Interiors" in Semiconductor Resin Packaging and IoT Technology.
The second webinar "Visualization of the Inside of Molds" hosted by Kistler Japan is finally approaching this Thursday. Using the semiconductor encapsulation process as an example, we will quantify the internal state of the mold, which can be considered a black box, with CG videos, and provide detailed know-how on improving major molding defects and enhancing production processes. Kistler's quartz piezoelectric internal pressure sensors, which have a high advantage, are optimal for the conditions of semiconductor encapsulation. We will also propose sensing technologies to improve major molding defects using quartz piezoelectric sensors effective for low-pressure measurements, such as epoxy transfer molding. Please check the details through the link below and register using the registration form. https://info.kistler.com/ja-webinar-sealed-molding Additionally, it may be helpful to view the technical explanation page below in advance for reference. https://info.kistler.com/sealed-molding-ja We look forward to many participants joining us.
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Webinar (2/18): This week! "Visualization Solutions for Mold Interiors" in Semiconductor Resin Encapsulation and IoT Technology.
The first webinar "Visualization of the Inside of Molds" hosted by Kistler Japan is finally approaching this Thursday. Using a CG video as an example of the semiconductor encapsulation process, we will quantify the internal state of the mold, which can be considered a black box, and provide detailed know-how for improving major molding defects and enhancing production processes. Kistler's piezoelectric pressure sensors are highly advantageous and are optimal for the conditions of semiconductor encapsulation. We will also propose sensing technologies to improve major molding defects using piezoelectric sensors effective for low-pressure measurements, such as epoxy transfer molding. Please check the details through the link below and register via the registration form. https://info.kistler.com/ja-webinar-sealed-molding Additionally, it may be helpful to view the technical explanation page below in advance for better understanding. https://info.kistler.com/sealed-molding-ja We look forward to the participation of many people.
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Webinar (2/25): "Visualization Solutions for Mold Interiors" in Semiconductor Resin Encapsulation and IoT Technology
In this webinar, we will use CG videos to quantify the internal state of molds, which can be considered a black box, using the semiconductor encapsulation process as an example. We will provide detailed insights into improving major molding defects and enhancing production processes. Kistler's piezoelectric pressure sensors are highly advantageous and optimal for the conditions of semiconductor encapsulation. We will also propose sensing technologies to improve major molding defects using piezoelectric sensors effective for low-pressure measurements, such as epoxy transfer molding. Please check the details through the link below and register using the registration form. https://info.kistler.com/ja-webinar-sealed-molding Additionally, it may be helpful to review the technical explanation page below in advance for better understanding. https://info.kistler.com/sealed-molding-ja The webinar will be held twice, but both dates will cover the same content. Please choose a date that is convenient for you. We look forward to the participation of many attendees.
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Webinar (2/18): "Visualization Solutions for Mold Interiors" in Semiconductor Resin Encapsulation and IoT Technology
In this webinar, we will use CG videos to quantify the internal state of molds, often referred to as a black box, using the semiconductor encapsulation process as an example. We will provide detailed insights into the know-how for improving major molding defects and enhancing production processes. Kistler's piezoelectric pressure sensors are highly advantageous and optimal for the conditions of semiconductor encapsulation. We will also propose sensing technologies to improve major molding defects using piezoelectric sensors effective for low-pressure measurements, such as in epoxy transfer molding. Please check the details through the link below and register using the registration form. https://info.kistler.com/ja-webinar-sealed-molding Additionally, it may be helpful to view the technical explanation page below in advance for better understanding. https://info.kistler.com/sealed-molding-ja The webinar will be held twice, but both dates will cover the same content. Please choose a date that is convenient for you. We look forward to the participation of many attendees.
