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Invitation to Exhibit at the Semiconductor and Sensor Packaging Exhibition (Nepcon Japan)

マーポス

マーポス

Our company will be exhibiting at the "Semiconductor and Sensor Packaging Exhibition (Nepcon Japan)" held at Tokyo Big Sight starting January 24, 2024 (Wednesday). (Booth number: E31-15) At this exhibition, we will introduce applications specifically designed for the semiconductor industry and non-contact measuring instruments that contribute to the reliability of the ever-evolving semiconductor manufacturing processes and the improvement of semiconductor performance. We cordially invite you to visit our booth and take a look. Exhibited products: - Non-contact thickness measurement gauge (interferometry technology) - Non-contact distance/thickness/thin film thickness measuring instrument (chromatic confocal technology) Please register for an admission badge via the URL below, and print it in color in advance before coming to the venue.* https://www.nepconjapan.jp/tokyo/ja-jp/register.html?code=0916133079345892-04F *Admission is by "pre-registration only."

Nepcon Japan
  • Date and time Wednesday, Jan 24, 2024 ~ Friday, Jan 26, 2024
    10:00 AM ~ 05:00 PM
  • Capital Tokyo Big Sight (East Exhibition Hall)
  • Entry fee Free Please register in advance by clicking the [Details / Application] button and print out your admission badge to bring with you.

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Optical Interference Measuring Instrument 'NCG'

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Chromatic confocal technology, non-contact measurement solution for thickness measurement 'STIL'

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