Notice of Participation in SEMICON JAPAN 2024

マーポス
Our company will exhibit at "SEMICON JAPAN 2024," which will be held at Tokyo Big Sight starting December 11, 2024 (Booth number: 2705). At this exhibition, we will introduce semiconductor industry-specific applications and non-contact measuring instruments that contribute to the reliability of the ever-evolving semiconductor manufacturing process and the improvement of semiconductor performance. We cordially invite you to visit our booth and take a look at our offerings. Exhibited products: - Non-contact thickness measurement gauge (interferometry technology) - Contact/non-contact (confocal technology) hybrid applications - Optical 3D surface roughness and shape measuring instruments - High-end 3D surface measurement for probe card inspection - Visual blade inspection system for dicing processes

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Date and time Wednesday, Dec 11, 2024 ~ Friday, Dec 13, 2024
10:00 AM ~ 05:00 PM
Advance registration is required for entry to this exhibition. - Capital Tokyo Big Sight (East Exhibition Hall)
- Entry fee Free Advance registration is required to enter this exhibition.