Notice of Participation in SEMICON JAPAN 2024

マーポス

Our company will exhibit at "SEMICON JAPAN 2024," which will be held at Tokyo Big Sight starting December 11, 2024 (Booth number: 2705). At this exhibition, we will introduce semiconductor industry-specific applications and non-contact measuring instruments that contribute to the reliability of the ever-evolving semiconductor manufacturing process and the improvement of semiconductor performance. We cordially invite you to visit our booth and take a look at our offerings. Exhibited products: - Non-contact thickness measurement gauge (interferometry technology) - Contact/non-contact (confocal technology) hybrid applications - Optical 3D surface roughness and shape measuring instruments - High-end 3D surface measurement for probe card inspection - Visual blade inspection system for dicing processes

Date and time Wednesday, Dec 11, 2024 ～ Friday, Dec 13, 2024
10:00 AM ～ 05:00 PM
Advance registration is required for entry to this exhibition.
Capital Tokyo Big Sight (East Exhibition Hall)
Entry fee Free Advance registration is required to enter this exhibition.

Related product information

Optical Interference Measuring Instrument 'NCG'
Shorten cycle time! A versatile and easy-to-use optical interference measuring instrument designed for convenience.

【Other Features】 ■ Designed for versatility and ease of use ■ Each individual unit controlled by the machine can be connected through a network of sensors ■ Unique technology allows for the measurement of various components (highly reflective, rough surfaces, opaque materials, etc.) ■ Improved electronics unit enables the storage of continuous data during measurements, which can be used for post-process measurement details, quality control, and machine performance evaluation *For more details, please refer to the PDF document or feel free to contact us.
Contact/Non-contact Hybrid Thickness Measurement Application 'P3CF'
Realizing non-contact thickness measurement of various materials that transmit white light.

For more details, please refer to the PDF document or feel free to contact us.
Optical 3D Surface Roughness and Shape Measurement Device 'VIKING'
Achieving high-speed and wide-ranging non-contact/non-destructive measurement on various surfaces.

Setup: Desktop System Horizontal Measurement Range / Movement Range: 150 mm x 150 mm Stage Flatness: ± 5 μm Allowable Load: Maximum 10 kg Vertical Movement Range: 25 mm Dimensions [W x D x H]: 475 mm x 450 mm x 434 mm Weight: 29 kg Power Supply Voltage: 100-240 V, 50-60 Hz File Formats: SUR, TXT, CSV Computer: Desktop (with monitor) Software: SolarScanNT, SolarMap
Probe Card Inspection "AOP-PCI"
High-precision 3D surface measurement to meet the demands of complex surface measurements.

Resolution: Horizontal resolution: 1 μm or more, vertical resolution: 1 nm or more Scan speed: Processing time for 30 x 30 mm probe chip array: less than 4 minutes (high resolution), processing time for 80 x 80 mm probe head shape: less than 3 minutes (low resolution) Dimensions: Made to order Changeover time (between different types of probe cards): less than 2 minutes *For more details, please refer to the PDF document or feel free to contact us.
Dicing Machine Sensor "VBI (Blade Inspection System)"
Achieving reduced cycle time in chip manufacturing and high quality! Sensors for blade monitoring during wafer cutting.

For more details, please refer to the PDF document or feel free to contact us.