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Notice of Participation in SEMICON JAPAN 2024

マーポス

マーポス

Our company will exhibit at "SEMICON JAPAN 2024," which will be held at Tokyo Big Sight starting December 11, 2024 (Booth number: 2705). At this exhibition, we will introduce semiconductor industry-specific applications and non-contact measuring instruments that contribute to the reliability of the ever-evolving semiconductor manufacturing process and the improvement of semiconductor performance. We cordially invite you to visit our booth and take a look at our offerings. Exhibited products: - Non-contact thickness measurement gauge (interferometry technology) - Contact/non-contact (confocal technology) hybrid applications - Optical 3D surface roughness and shape measuring instruments - High-end 3D surface measurement for probe card inspection - Visual blade inspection system for dicing processes

  • Date and time Wednesday, Dec 11, 2024 ~ Friday, Dec 13, 2024
    10:00 AM ~ 05:00 PM
    Advance registration is required for entry to this exhibition.
  • Capital Tokyo Big Sight (East Exhibition Hall)
  • Entry fee Free Advance registration is required to enter this exhibition.

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Optical Interference Measuring Instrument 'NCG'

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Contact/Non-contact Measurement (Chromatic Confocal Technology) Hybrid Application 'P3CF'

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Optical 3D Surface Roughness and Shape Measurement Device 'VIKING'

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Probe Card Inspection "AOP-PCI"

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Sensor for Dicing Machines 'VBI (Visual Blade Inspection System)'

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