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All applicants will receive a gift! Basics of surface analysis and examples of contract analysis.
<XPS・TOF-SIMS> A comprehensive explanation of what surface analysis is, the types of surface analysis, and other fundamental aspects. Additionally, representative examples using surface analysis are included.
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[Analysis Case] Damage Assessment of Single Crystal Si Surface
Quantitative analysis of c-Si and a-Si by state is possible using high-resolution measurement and waveform analysis.
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[Analysis Case] High Sensitivity Evaluation of SNDM's SiCMOS
The diffusion layer structure of SiC devices can be visualized (high-sensitivity evaluation of the diffusion layer structure).
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Analysis case: Metal content analysis in a solution
High-sensitivity analysis of various solutions, such as pure water and wafer cleaning liquids, is possible.
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[Analysis Case] Non-destructive 3D Structural Observation of SiC Discrete Packages
Non-destructive three-dimensional observation of the internal structure of a discrete package.
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[Analysis Case] Evaluation of Surface Roughness of SiC Trench MOSFET Trench Sidewalls
Quantitative evaluation of the roughness of trench sidewalls related to device characteristics.
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[Analysis Case] Hair Component Analysis
It is possible to evaluate hair components according to the purpose.
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[Analysis Case] STEM/EDX and Image Simulation for Crystal Structure Evaluation
The evaluation of the crystal structure can be performed based on the STEM images and the results of atomic composition measurements.
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[Analysis Case] SiC by SMM and SNDM
You can evaluate the p/n polarity and carrier concentration distribution of the diffusion layer in SiC devices.
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[Analysis Case] Structural Analysis of Amorphous SiNx Films Using Molecular Dynamics Calculations
Microscopic structural analysis of amorphous films is possible through simulation.
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[Analysis Case] Electronic State Evaluation of Wide Bandgap Semiconductor Dopant Site Identification
Evaluation of microscopic atomic structures is possible through computational simulation.
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[Analysis Case] Structural Analysis of DRAM Chips using TEM and SEM
Reverse engineering of DRAM on the product's internal substrate.
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[Analysis Case] Comparison of Secondary Electron Images of Cu Surface Using SEM and SIM
It is effective to differentiate between the two methods depending on the surface structure of interest.
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[Analysis Case] Observation of Crystal Grains on Cu Surface Using Scanning Ion Microscopy
It is possible to obtain insights into the size and distribution of crystal grains in metallic polycrystals.
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[Analysis Case] Three-Dimensional Structural Observation and Membrane Thickness Analysis of Seamless Capsules
Evaluation and analysis of seamless capsules is possible using X-ray CT.
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[Analysis Case] Evaluation of Voids Inside Pancakes
Non-destructive observation of the internal structure of food using X-ray CT.
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[Analysis Case] Imaging Analysis of Pesticide Active Ingredients in Formulations
You can visualize the distribution of pesticide active ingredients and inorganic components in the formulation.
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[Analysis Case] Evaluation of Internal State of Transistor
We evaluate abnormalities inside the device non-destructively.
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[Analysis Case] Evaluation of Curing Degree of Epoxy Resin by FT-IR
It is possible to evaluate the degree of curing of the resin by capturing changes in functional groups.
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[Analysis Case] Non-destructive Observation of Lithium-ion Secondary Battery Internals
Case studies observed using X-ray CT.
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[Analysis Case] Evaluation of Organic Component Desorption in a Vacuum
The temperature dependence evaluation of the desorption of specific organic components is possible through composite analysis.
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[Analysis Case] Tensile Test of Foam Rubber Using X-ray CT
Measurement and analysis of shape changes inside the sample in situ.
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[Analysis Case] TDS Analysis of Epoxy Resin
It is possible to investigate the degassing behavior of organic matter in a vacuum.
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[Analysis Case] Simultaneous Heating Analysis of Copper Plates and Solder by TDS
It is possible to evaluate degassing in an environment close to the actual process by bringing the materials into contact with each other.
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[Analysis Case] Evaluation of Curing Degree of Polyimide Resin by FT-IR
By capturing changes in functional groups, it is possible to evaluate the imidization rate of the resin.
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[SXES] Soft X-ray Emission Spectroscopy
SXES is a method that evaluates the chemical bonding state using soft X-rays emitted from materials.
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X-ray CT method
X-ray Computed Tomography
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[Analysis Case] Investigation of Voids Inside Bonded Wafers Using C-SAM
We will evaluate the internal structure of the device in a comprehensive manner.
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[Analysis Case] Non-destructive Analysis of Cosmetics
The internal structure of the product can be evaluated non-destructively using X-ray CT.
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[Analysis Case] Measurement of Organic and Inorganic Carbon Content in Food
It is possible to evaluate the carbon content of organic and inorganic substances in solids.
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