Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.

日精本社

We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!

Date and time Monday, Dec 14, 2020 ～ Thursday, Dec 17, 2020
Capital
Entry fee Free

Related product information

Mass production ultrasonic dicing equipment: Ultrasonic cutting device CSX501
Ultrasonic assisted spindle equipped with a dual-end support mechanism that enables high-speed, high-precision cutting, improving productivity and quality - Ultrasonic dicing device!!

【Specifications】 ■Compatible work sizes: 6, 8 inches (shared) ■Blade height: Maximum 12mm (cutting limit 10mm) ■Cleaning method: 2-fluid JET + high-pressure JET ■Conveying mechanism: In-house manufactured conveying mechanism ■Device specifications: Fully automatic ■Options: Inline dress, pre-cut function, blade twister ■Equipped with constant damage detection function ■Supports upper-level communication ■Dimensions: W1,200 × D1,300 × H1,850 mm *For more details, please refer to the PDF document or feel free to contact us.
Prototype development of a single-sheet automatic resist peeling and lift-off device "manufactured by Takada Kogyo Co., Ltd."
A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.

【Specifications】 ■ Compatible work sizes are 2 to 8 inches (for square substrates, please inquire about 12 inches) ■ Automatic transport of workpieces by a SCARA robot ■ Heating function for chemical solutions ■ Safety features including an automatic fire extinguishing system and explosion-proof glass ■ Automatic cleaning function inside the chamber ■ Various nozzle specifications can be changed (for details, please inquire) ■ Backside wrap-around prevention feature
Mass production-oriented sheet-type automatic resist stripping and lift-off device "Takada Kogyo Co., Ltd."
A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.

【Specifications】 ■ Compatible work sizes are 2 to 8 inches (for square substrates, please inquire about 12 inches) ■ Automatic transport of workpieces by a SCARA robot ■ Heating function for chemical solutions ■ Equipped with an automatic fire extinguishing system and safety features such as explosion-proof glass ■ Automatic cleaning function inside the chamber ■ Various nozzle specifications can be modified (for details, please inquire) ■ Anti-backside wraparound feature ■ Expandable up to a maximum of 4 chambers ■ Compatible with upper-level communication systems
Dicing ring cleaning device "Manufactured by Takada Kogyo Co., Ltd."
Dicing ring (frame) cleaning device available in two types: jet cleaning type (non-contact) and scrub cleaning type (contact).

■Compatible work sizes range from 6 to 12 inches (multi-size support is also available. Please inquire) ■Jet cleaning type can also handle treatments using organic solvents ■Scrub cleaning type allows for changes in scrub material specifications depending on the level of dirt and frame material ■Tape removal function for dicing frames with tape (optional) ■Compatible with higher-level communication (optional)
Research and development sheet-type resist stripping and lift-off device "Manufactured by Takada Engineering."
A sheet-type resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from high-pressure jets [testable].

【Specifications】 ■ Compatible work size is 2 to 8 inches (※ Please inquire about square substrates and 12 inches) ■ Workpieces are manually placed by the operator ■ Heating function for chemical solutions available ■ Safety features such as explosion-proof glass included ■ Various nozzle specifications can be changed (※ Please inquire for details)
Dicing Ion Milling Preprocessing Equipment "Takada Seisakusho"
Achieving efficiency in the preparation of cross-sectional observation samples! Ultrasonic cutting device for ion milling pretreatment can also replace polishing machines. *Demo tests available.

【Specifications】 ■Compatible work sizes: φ100 mm, □75 mm ■Cutting height: 9 mm ■Device dimensions: 640W mm × 900D mm × 1350H mm 　　(Excluding protrusions, warning lights, and monitor 80W mm, 350H mm) ■Device weight: 380 kg
Ultrasonic cutting device for sample preparation for cross-section and SEM observation.
No resin embedding! Achieving efficiency in cross-section sample preparation without the need for skills. Contributing to the efficiency of SEM observation. 'Ultrasonic Cutting Device CSX-100Lab'

【Specifications】 ■Compatible work sizes: φ100mm, 75mm square ■Cutting height: 9mm ■Device dimensions: 640W mm × 900D mm × 1,350H mm 　　(Excluding protrusions, warning lights, and monitor 80W mm, 350H mm) ■Device weight: 380kg *For more details, please refer to the PDF document or feel free to contact us.