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Area sensor for internal defect inspection after welding as a substitute for X-rays, with over 15,000 units of monitoring systems during welding in operation.

For details, please refer to the application materials. We will also be exhibiting at the Battery Expo (Makuhari Messe) to be held in October 2024.

High-speed opaque film thickness mapping and area detection of internal defects using a laser photothermal sensor.

■Thickness measurement range 　~1mm ■Measurement accuracy 　Approximately 1~3% ■Spatial resolution 　Minimum 28um ■Measurement modes 　Phase shift, amplitude ■Product lineup 　Two types: HR (high resolution) and LF (wide field)

It is possible to obtain the quality assessment results of the product simultaneously with the completion of laser welding. It is equipped with a user-friendly GUI that facilitates easy operations such as data linking, review, and analysis.

<Sensor> - Compact Sensor: Analog sensor for fundamental wave - Digital Sensor: Available for fundamental wave, as well as green and blue <Control Device Shapes> - LWM Standard: Full-size cabinet - LWM Compact: Mid-size case - LWM OEM: Mounting plate for 19-inch rack - LWM Base: Control equipment only (requires assembly) [Keywords for Applications, Measurement Items, Benefits, etc.] Disk laser, fiber laser, diode laser, green laser, blue laser, YAG, fundamental wave, second harmonic, third harmonic, Disk, Fiber, LD, LDD, fixed optical head, scanner, solid-state laser, scanner, time-sharing, 250kHz

Introducing the measurement principles of each sensor, corresponding sensors, product information, and ease of use!

For more details, please refer to the PDF document or feel free to contact us.

For high-precision thickness measurement of opaque materials, Enovasense's laser photo-thermal sensor can measure thickness from a minimum of 10nm, regardless of the material.

■Thickness measurement range 10nm~1mm ■Measurement accuracy 0.5~3% or less ■Beam spot diameter φ0.15mm or more ■Measurement mode Phase shift, amplitude ■Product lineup Multiple lineups available for probes (working distance, beam spot diameter) and lasers (wavelength, power)

Non-contact line sensor CLS. High precision, high speed, and wide range 3D shape measurement. High tolerance for angles suitable for edges and slopes. Numerous achievements in wafer edge measurement.

【Application】 Non-contact 3D shape measurement is possible. It is also possible to replace contact methods with non-contact methods. ■ Home Appliances (Smartphones) - LCD glass - OLED mask inspection - Fine scratches and other surface defects - Wire bonding - AR glasses ■ Semiconductor Manufacturing Process - Wafer edge shape measurement - Wafer edge defect inspection - Wafer dicing groove appearance inspection - BGA inspection - IC package and circuit inspection ■ Automotive - Valve inspection - Car interior - Glass inspection - Inspection of airbag welding beads

High-speed area scanning unaffected by vibrations. For online, offline, quality control, and wafer inspection applications.

【Semiconductor Applications】 ■ High-speed BGA Measurement ■ High-speed Substrate Inspection ■ High-speed Wafer Thickness Measurement ■ High-speed Warpage Measurement *For more details, please refer to the PDF document or feel free to contact us.

This is a high-speed, high-precision line camera for inline appearance inspection, also suitable for wafer inspection applications.

【Excellent Performance】 ■ Maximum Data Acquisition: 100kHz (200MPixel/sec) ■ Depth of Focus: 150μm to 3mm ■ Resolution: 1 to 5μm *For more details, please refer to the PDF document or feel free to contact us.