Optical area scanner "Flying Spot Scanner"
High-speed area scanning unaffected by vibrations. For online, offline, quality control, and wafer inspection applications.
The "Flying Spot Scanner" is an optical measuring device that can perform wide-area scans (up to φ80) using XY2-axis galvanometer mirrors. Since stage scanning is not required, there is no influence from vibrations of the stage. Thanks to the principle of spectral interference, it can measure thickness, dimensional shapes, and inspect surface defects. Additionally, because the incident and reflected light are in a coaxial optical system, good results can be obtained even on glossy surfaces. 【Features】 ■ Wide-area scanning ~φ80mm ■ High resolution XY 6.5μm~, Z 1nm~ Minimum beam spot diameter 13μm, high Z resolution due to spectral interference method ■ No XY stage required, no stage vibrations Area scanning using galvanometer mirrors ■ Reduced development costs and shortened development lead times Software development kit (DLL, etc.) available for device integration ■ Applications Thickness measurement of glass substrates for FPD and LCD, measurement of wafer warp (distortion), lens shape inspection, PCB board shape inspection, height measurement of small precision parts, etc. *For more details, please refer to the materials. Feel free to contact us with any inquiries.
basic information
【Semiconductor Applications】 ■ High-speed BGA Measurement ■ High-speed Substrate Inspection ■ High-speed Wafer Thickness Measurement ■ High-speed Warpage Measurement *For more details, please refer to the PDF document or feel free to contact us.
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[Keywords: Applications, Measurement Items, Benefits, etc.] Non-contact sensors, optical sensors, spectroscopic interference method, thickness, thin films, thick films, gaps, height, flatness, TTV (Total Thickness Variation), shape, measurement, inspection, high speed, 3D, area scan, full surface, high precision, inline, monitoring, in-situ, during processing, before and after processing, polishing, offline, standalone machines, tabletop machines, sampling, embedded, semiconductors, wafers, wafer bonding, Si wafers, Si, GaAs, InP, SiC, LiNbO3 (LN), LiTaO3 (LT), GaN, SiP, Al2O3 (sapphire), weld joints, glass, PCB, coating, films, multilayer films, applied films, conformal coating, electrode layer coating, stent coating, polyimide, PVB, resin materials, flux, adhesives, insulating films, air layers, transparent, transparent bodies, gloss, mirror finish, simple.
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